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+\newlabel{fig:approach_curve_example}{{1.18}{25}{(a) capacitance (approach) curve. (b) difference of each capacitance value. Only one sensor is shown. Marked with blue dashed lines are the important points where the slope of the $\frac {1}{r}$ curve changes. Below are images of the geometry between mask and sample at First (c), Second (d) and Full contact (e). Red lines or points indicate where the mask is touching the sample}{figure.caption.22}{}}
+\citation{Beeker}
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+\newlabel{fig:afm_potential}{{1.21}{30}{Schematic diagram of the Lennart Jones potential governing the interaction between tip and sample in an AFM. The 3 areas of the AFM Modes are marked \textcolor {tab_green}{contact}, \textcolor {tab_blue}{tapping} and \textcolor {tab_red}{non-contact}. These regions are approximate. Units on both axes are arbitrary}{figure.caption.27}{}}
+\@writefile{toc}{\contentsline {paragraph}{Contact}{30}{section*.28}\protected@file@percent }
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 \citation{SEM_book}
 \citation{SEM_book}
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+\newlabel{fig:sem_setup_beam}{{1.22a}{32}{\relax }{figure.caption.32}{}}
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+\@writefile{lof}{\contentsline {figure}{\numberline {1.22}{\ignorespaces The beam path for an SEM (\subref  {fig:sem_setup_beam}). The three detectors used in an SEM are shown near the bottom of the image. The secondary electron detector (Everhard-Thornley) and the back scattering and X-ray detector. A diagram showing electron matter interactions (\subref  {fig:sem_setup_interaction}). The green area represents the penetration depth into the sample at which the different signals can be detected. Images were taken from~\cite  {SEM_image_01} and ~\cite  {SEM_image_02}.}}{32}{figure.caption.32}\protected@file@percent }
+\newlabel{fig:sem_setup}{{1.22}{32}{The beam path for an SEM (\subref {fig:sem_setup_beam}). The three detectors used in an SEM are shown near the bottom of the image. The secondary electron detector (Everhard-Thornley) and the back scattering and X-ray detector. A diagram showing electron matter interactions (\subref {fig:sem_setup_interaction}). The green area represents the penetration depth into the sample at which the different signals can be detected. Images were taken from~\cite {SEM_image_01} and ~\cite {SEM_image_02}}{figure.caption.32}{}}
 \citation{self_epitaxy}
 \@setckpt{chap01}{
-\setcounter{page}{31}
+\setcounter{page}{34}
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diff --git a/chap01.tex b/chap01.tex
index 47ca0d3d9e29abbb03623d512b47d07dc5b6e3cc..30513f8d1ff703bde5893de95a244f005d83d5e8 100644
--- a/chap01.tex
+++ b/chap01.tex
@@ -98,10 +98,8 @@ While non-contact mode damages the tip and the sample less. It comes with the co
 
 \paragraph{Tapping}
 %Tapping mode is a hybrid of both contact and non-contact modes. 
-is also sometimes called semi contact mode. Here the tip is oscillated near the resonance frequency, but closer than in non-contact mode. The oscillation is affected by both the attractive and the repulsive part of the tip-surface potential. At the lower part of this oscillation, the tip contacts the surface. The feedback loop is the same as in non-contact mode. Due to the closer distance to the sample's surface however, the resolution is higher and a transparency with regard to thin films on the samples surface is achieved. But the tip's lifespan is reduced, due to the tapping contacting the surface. It is however much longer, than that of contact mode and damage to the sample is minimal. In this thesis, only the tapping mode of the AFM is used. As analysis was performed under atmospheric conditions.
-
+is also sometimes called semi contact mode. Here the tip is oscillated near the resonance frequency, but closer than in non-contact mode. The oscillation is affected by both the attractive and the repulsive part of the tip-surface potential. At the lower part of this oscillation, the tip contacts the surface. The feedback loop is the same as in non-contact mode. Due to the closer distance to the sample's surface however, the resolution is higher and a transparency with regard to thin films on the samples surface is achieved. But the tip's lifespan is reduced, due to the tapping contacting the surface. It is however much longer, than that of contact mode and damage to the sample is minimal. In this thesis, only the tapping mode of the AFM is used. 
 There are more ways to get useful sample information from an AFM. The tip can, for example be alloy in a magnetic coating for Magnetic Force Microscopy. For the purposes of this thesis other uses will be neglected.
-
 AFMs provide high resolution topographical images at the nanometer scale and allow for accurate estimation of surface properties of a sample's surface. Atomic force microscopy is a commonly used tool to characterize nano-lithography samples and has been extensively used in physics, material science and biology among others~\cite{afm_physics, afm_bio}.
 
 \todo{Check this again}
diff --git a/chap02.tex b/chap02.tex
index d55e4080cef6d98a0c29ea28494182d3eb108482..4fe6432646971e172414030ec088aa46dcc2a4a7 100644
--- a/chap02.tex
+++ b/chap02.tex
@@ -143,9 +143,19 @@ frame can be positioned via 3 micrometer screws in x, y and z
 direction. Additionally, the camera can be rotated around $2$ axes allowing full
 control of the camera angle. \\
 
-The procedure for step size calibration is very simple: $2000$, $4000$,
-$6000$, $8000$ and $10000$ steps are driven and after each set of steps the distance
-the prism has traveled in the image of the camera is measured. This is done with the Bresser MicroCam II software. In the software a line is drawn at the initial position, from a remarkable point on the motor (Fig. \ref{fig:calibration_uhv_points_of_interest}). After driving another line is drawn at the end position. The distance between these are measured using the software. An example for motor Z1 and Z2 is shown in Figure \ref{fig:calibration_uhv_example_driving} for a $1000$ step measurement. If changes to the motors have been performed a calibration has to be performed outside of UHV before reinsertion into UHV. Afterwards the motors have to be calibrated in UHV. \\
+The step size calibration procedure involves the following steps:
+\begin{itemize}
+	\item Drive the motor for 2000, 4000, 6000, 8000, and 10000 steps.
+	\item After each set of steps, measure the distance the prism has traveled in the camera image using the Bresser MicroCam II software.
+	To do this, draw a line at the initial position of the motor, referencing a distinct point on the motor (as shown in Figure \ref{fig:calibration_uhv_points_of_interest}).
+	\item After driving the motor, draw another line at the end position.
+	\item Measure the distance between the two lines using the software.
+\end{itemize}
+An example of this process for motors Z1 and Z2 is shown in Figure \ref{fig:calibration_uhv_example_driving} for a $1000$-step measurement. \\
+
+The procedure for step size calibration is: $2000$, $4000$,
+$6000$, $8000$ and $10000$ steps are driven. After each set of steps the distance
+the prism has traveled in the image of the camera is measured. This is done with the Bresser MicroCam II software. In the software a line is drawn at the initial position, from a remarkable point on the motor (Fig. \ref{fig:calibration_uhv_points_of_interest}). After driving another line is drawn at the end position. The distance between these is measured using the software. An example for motor Z1 and Z2 is shown in Figure \ref{fig:calibration_uhv_example_driving} for a $1000$ step measurement. If changes to the motors have been performed a calibration has to be performed outside of UHV before reinsertion into UHV. Afterwards the motors have to be calibrated in UHV. \\
 
 \begin{figure}[H]
 	\centering
@@ -185,11 +195,11 @@ the prism has traveled in the image of the camera is measured. This is done with
 
 %Outside UHV the best points are small scratches on the prisms
 %\ce{Al2O3} plate, since these are already in a focal plane with the motors.
-The distance measurement using the camera is calibrated by using an object of known size in the focal plane. One example that can be used are the \ce{Nd} magnets ($5$ mm diameter). \\
-The motors Z2 and Z3 cannot be directly observed in the Mask Aligner chamber. Instead, the 2
-screws very close to the motors (seen in Figure
-\ref{fig:calibration_uhv_points_of_interest}
-\subref{fig:calibration_uhv_points_of_interest_z2z3}) are observed. For camera calibration their diameter is chosen as this is also known to be $3$ mm. 
+The camera-based distance measurement is calibrated using an object of known size in the focal plane. One suitable example is the Nd magnets, which have a diameter of $5$ mm. \\
+
+However, motors Z2 and Z3 are not directly visible in the Mask Aligner chamber. Instead, the two screws located near these motors (as shown in Figure \ref{fig:calibration_uhv_points_of_interest} \subref{fig:calibration_uhv_points_of_interest_z2z3}) are observed. For calibration purposes, the diameter of these screws is used, which is known to be $3$ mm.
+Since the screws are slightly closer to the camera than the motors themselves, a simple trigonometric model (illustrated in Figure \ref{fig:calibration_screw_diff_explain}) is used to account for this difference. This model reveals that for every unit of distance the motor moves, the screws move by a factor of $h' = \frac{17.8}{23.74} \approx 0.75$. \\
+
 The screws are a little closer to the camera than the motors themselves, this is accounted for by using a simple trigonometric model seen in Figure \ref{fig:calibration_screw_diff_explain}. 
 With this one gets that for each unit of distance the motor moves, the screws move by $h' = \frac{17.8}{23.74} \approx 0.75$. \\
 
@@ -207,10 +217,9 @@ With this one gets that for each unit of distance the motor moves, the screws mo
 	\label{fig:calibration_example}
 \end{figure}
 
-A linear fit is performed for the given data. The slope gives the step size. Results are shown in Figure \ref{fig:calibration_example}. After each set of steps it has to be ensured, that the mask frame is not tilted. Excessive tilt will affect the step size. It should also be taken care that the movement range of the piezos is not exceeded. The \ce{Nd} magnets should not detach from the frame. Moreover, the sapphire prism can fall out of the motor if it is driven too far down. The measurement has to be done for both driving directions separately, since the step sizes will be different. Indeed, in Fig. \ref{fig:calibration_example} shows that the positive retract direction has consistently larger step sizes. The Z3 motor also shows a larger difference in step size for approach and retract than the other $2$ motors.
+A linear fit is performed for the given data. The slope gives the step size. Results are shown in Figure \ref{fig:calibration_example}. After each set of steps it has to be ensured, that the mask frame is not tilted. Excessive tilt will affect the step size. After each set of steps, it is essential to verify that the mask frame is not tilted, as excessive tilt can affect the step size. Additionally, care must be taken to avoid exceeding the movement range of the piezos, detaching the Nd magnets from the frame, or causing the sapphire prism to fall out of the motor. The measurement has to be done for both driving directions separately, since the step sizes will be different. Indeed, in Fig. \ref{fig:calibration_example} shows that the positive retract direction has consistently larger step sizes. Furthermore, the Z3 motor displays a larger difference in step size between approach and retract compared to the other two motors. \\
 
-This calibration has been performed for various voltage amplitudes. This can be
-seen in Figure \ref{fig:calibration_voltage} 
+To account for the varying step sizes between the three motors, different voltage pulses can be applied to each motor. A calibration is necessary to determine the relationship between step size and voltage, which is illustrated in Figure \ref{fig:calibration_voltage}. \\
 
 \begin{figure}[H]
     \centering
@@ -225,6 +234,8 @@ each motor. An optimum, where all motors drive similarly is at $80$ V. Also noti
 Z3. Z3 is much more influenced by voltage than the other motors, where the
 step size/V is larger by $\approx 0.3$. This calibration is used to compensate motor step size variations to avoid tilting. For this different voltage pulses need to be applied to the difference motor channels. The electronics required for this are discussed further in Chapter \ref{sec:walker}.\\
 
+The motor behavior exhibits a linear relationship with voltage, but the slope of this relationship varies between motors. An optimal point, where all motors respond similarly, is found at $80$ V. Notably, the Z3 motor exhibits a significantly different slope, with a step size per Volt that is approximately $0.3$ larger than the other motors. This calibration is used to compensate for variations in motor step size, which helps to prevent tilting. To achieve this, different voltage pulses need to be applied to the various motor channels. The electronics required for this purpose are discussed in more detail in Chapter \ref{sec:walker}.\\
+
 \subsection{Optical alignment}
 The capacitance sensors cannot be used for alignement when the mask sample distance is very large, since the signal is noise dominated at that point. Therefore one starts by aligning optically, down to the optical limit ($25$ $\mu$m) of this setup. \\
 To do that the sample has to be aligned so that its surface normal
@@ -289,11 +300,9 @@ achievable optical accuracy.
 \newpage
 \subsection{Capacitive distance measurements}
 
-The mask is aligned to the sample via capacitive measurement. The three
-capacitive sensors on the mask are setup to correspond with the three motors (Fig. \ref{fig:mask_aligner_nomenclature_capacitances_motors}). They are labeled as seen in Figure \ref{fig:mask_aligner_nomenclature_capacitances_motors}. 
-\footnote{Note that this is not true for all masks. Some of the ones provided are assembled incorrectly.}
-The masks used were created in Canada by the company Norcada.
-Each mask consist of a $200$ $\mu$m thick \ce{Si} body. A $100\times100$ $\mu$m \ce{SiN} membrane, with circular $3$ $\mu$m diameter holes, $10$ $\mu$m apart from each other, is situated in the center. The \ce{SiN} covers the whole mask and is $1$ $\mu$m thick. Below the center of the mask a trench is carved in the \ce{Si}. Around the hole membrane are three gold pads, that function as capacitive sensors. The \ce{Au} of the gold pads is placed below an insulating $\approx 100$ nm layer of \ce{SiO2} at the bottom of a trench in the \ce{Si} body. They are at a distance of $0.7$ mm from the hole membrane and are located in an equilateral triangle around it. The dimensions of the mask and the capacitive sensors on the mask can be seen in Figure \ref{fig:mask_aligner_nomenclature_capacitances_mask}.
+The mask is aligned with the sample using capacitive measurements. The three capacitive sensors on the mask are configured to correspond with the three motors, as shown in Figure \ref{fig:mask_aligner_nomenclature_capacitances_motors}. The sensors are labeled accordingly, although it is worth noting that not all masks are assembled correctly. \\
+The masks used in this setup were manufactured by Norcada in Canada. Each mask consists of a $200$ $\mu$m thick \ce{Si} body. At the center of the mask, a $100\times100$ $\mu$m silicon nitride (\ce{SiN}) membrane is situated, featuring circular holes with a diameter of $3$ $\mu$m, spaced $10$ $\mu$m apart. The SiN layer covers the entire mask and is 1 $\mu$m thick. A trench is carved into the Si body below the center of the mask. \\
+Three gold pads, functioning as capacitive sensors, are located around the hole membrane. These pads are positioned below an insulating layer of approximately $100$ nm thick silicon dioxide (\ce{SiO2}), which is situated at the bottom of a trench in the \ce{Si} body. The gold pads are $0.7$ mm away from the hole membrane and are arranged in an equilateral triangle around it. The dimensions of the mask and the capacitive sensors are illustrated in Figure \ref{fig:mask_aligner_nomenclature_capacitances_mask}.
 
 \begin{figure}[H]
     \centering
@@ -333,9 +342,7 @@ the area of the gold pad and $r$ is the distance between the mask surface and th
 are the thickness of the \ce{SiN} and \ce{SiO2} layers above the gold pad. This holds true until
 the mask's surface gets in contact with the sample. Contamination particles can also cause indirect contact of mask and sample.
 The distance to the sample can in theory be read off from the capacitance value via Eq.
-\ref{eq:plate_capacitor}. However, with real masks the capacitance values can
-deviate drastically from the model. Without a point of
-reference, no assessment of the absolute distance can be made. A measurement of the capacitance while bringing the mask into contact with the sample and subsequent retraction are used as this reference.
+\ref{eq:plate_capacitor}. In practice, the capacitance values obtained with real masks can significantly deviate from the theoretical model. Without a reference point, it is impossible to determine the absolute distance between the mask and the sample. To address this, a measurement of the capacitance is taken while the mask is brought into contact with the sample and then retracted, providing a reference calibration.
 
 
 \begin{figure}[H]
@@ -377,20 +384,25 @@ where the mask is touching the sample.}
 
 A typical approach curve, from a measured distance of $25 \pm 5$ $\mu$m to full contact is shown in Figure \ref{fig:approach_curve_example_cap}. \\
 
-Usually the mask will start contacting the sample with one point (or potentially an edge) first. An illustration of
-this is shown in Figure \ref{fig:approach_curve_example_first}. The first contact inhibits
-the movement of the mask on the associated motor, resulting in a changed
-step size. Due to this step size change, the slope of the approach curve changes. 
-If the mask contacts the sample with another point (Figure \ref{fig:approach_curve_example_second}) the step size decreases again. This is labeled in Figure
-\ref{fig:approach_curve_example_cap} as "Second contact". If the sample is
-approached further, the only axis of movement left for the mask is the one
-aligning the mask to the sample perfectly (Figure
-\ref{fig:approach_curve_example_full}). At this point, the capacitance value no
-longer changes since the distance between mask and sample can no longer be
-decreased. This point is labeled "Full contact" in Figure
-\ref{fig:approach_curve_example_cap}. \\
-
-The difference in capacitance increases monotonically. Upon any contact the step size changes and the $dC$ curve gives a local maximum. This can be used to define a stop condition. A value $5-10$ steps before the peak~\cite{Beeker} is determined in a calibration measurement to full contact. When this value is reached in any subsequent approach the approach is stopped. How close the value can be chosen to the peak depends on the noise of the signal. \\
+Typically, the mask initially contacts the sample at a single point or edge, as illustrated in Figure \ref{fig:approach_curve_example_first}.This initial contact restricts the movement of the mask on the corresponding motor, resulting in a change in the step size. Consequently, the slope of the approach curve changes. \\
+If the mask subsequently contacts the sample at another point (Figure \ref{fig:approach_curve_example_second}), the step size decreases again, which is labeled as "Second contact" in Figure \ref{fig:approach_curve_example_cap}. \\
+As the sample is approached further, the mask's movement becomes limited to the axis that aligns the mask with the sample perfectly (Figure \ref{fig:approach_curve_example_full}). At this point, the capacitance value remains constant, as the distance between the mask and sample can no longer be reduced. This point is marked as "Full contact" in Figure \ref{fig:approach_curve_example_cap}. \\
+
+%Usually the mask will start contacting the sample with one point (or potentially an edge) first. An illustration of
+%this is shown in Figure \ref{fig:approach_curve_example_first}. The first contact inhibits
+%the movement of the mask on the associated motor, resulting in a changed
+%step size. Due to this step size change, the slope of the approach curve changes. 
+%If the mask contacts the sample with another point (Figure \ref{fig:approach_curve_example_second}) the step size decreases again. This is labeled in Figure
+%\ref{fig:approach_curve_example_cap} as "Second contact". If the sample is
+%approached further, the only axis of movement left for the mask is the one
+%aligning the mask to the sample perfectly (Figure
+%\ref{fig:approach_curve_example_full}). At this point, the capacitance value no
+%longer changes since the distance between mask and sample can no longer be
+%decreased. This point is labeled "Full contact" in Figure
+%\ref{fig:approach_curve_example_cap}. \\
+
+The difference in capacitance increases monotonically. Upon any contact the step size changes and the $dC$ curve gives a local maximum. This can be used to define a stop condition. A value $5-10$ steps before the peak~\cite{Beeker} is determined in a calibration measurement to full contact. When this value is reached in any subsequent approach the approach is stopped. 
+%How close the value can be chosen to the peak depends on the noise of the signal. \\
 %Another way of looking at this is to consider the differences between $2$ capacitance values:
 %\begin{equation}
 %	C_2 - C_1 = \epsilon_0 \epsilon_r \frac{A}{r + r'} - \epsilon_0 \epsilon_r
@@ -419,36 +431,36 @@ The difference in capacitance increases monotonically. Upon any contact the step
 %	\label{fig:approach_subsequent}
 %\end{figure}
 
-%\subsection{Reproducibility}
-%Reproducibility of approach curves with regard to different samples and masks is important for the future use of the Mask Aligner. In the master thesis of Jonas Beeker the
-%reproducibility of different masks, different locations, different approaches
-%and a comparison before and after evaporation were discussed~\cite{Beeker}.
-%
-%\subsubsection{Reproducibility when removing sample/mask}
-%
-%One question concerning reproducibility is whether the approach curve is strongly affected by the exchange of mask or sample, or even just the reinsertion of mask or sample. This can be used to perform a calibration approach curve on one sample and exchange the sample for another. This potentially allows for the evaporation on samples, which were never put into contact with a mask.
-%
-%\begin{figure}[H]
-%    \centering
-%	\begin{subfigure}{0.495\textwidth}
-%    \includegraphics[width=\linewidth]{img/MA/InsertionReproducibility.pdf}
-%    \caption{}
-%	\label{fig:approach_replicability_cap}
-%	\end{subfigure}
-%	\begin{subfigure}{0.495\textwidth}
-%    \includegraphics[width=\linewidth]{img/MA/InsertionReproducibility_diff.pdf}
-%    \caption{}
-%	\label{fig:approach_replicability_cap_diff}
-%	\end{subfigure}
-%	\caption{(\subref{fig:approach_replicability_cap}) 3 subsequent approach curves.  (\subref{fig:approach_replicability_cap_diff}) corresponding differences in capacitance. \textcolor{tab_green}{Green} is the initial curve. The \textcolor{tab_blue}{blue} curve is after sample has been carefully removed and reinserted. For the \textcolor{tab_red}{red} curve the mask was removed and reinserted. Larger fluctuations in the signal visible on the \textcolor{tab_blue}{Blue} curve are due to an accidental change in time constant of the LockIn Amplifier.}
-%    \label{fig:approach_replicability}
-%\end{figure} 
-%
-%Reinserting the mask, the approach curve changed drastically, which can likely be attributed to newly induced tilt on the mask. This can be seen in the shift between the \textcolor{tab_green}{green} and \textcolor{tab_red}{red} curves in Figure \ref{fig:approach_replicability}.
-%
-%Another reason might be small movement of the mask frame on the \ce{Nd} magnets tilting the mask. This problem cannot be fixed without a complete redesign of the Mask Aligner. \\
-%
-%Reinserting the sample also induced a difference in approach curves, but this difference is much smaller as can be seen in Figure \ref{fig:approach_replicability} (\textcolor{tab_blue}{blue} and \textcolor{tab_green}{green}). The trend of the curve remains the same, but the absolute value changes slightly. However, the peak in $dC$ changed significantly. A stop condition determined on the \textcolor{tab_green}{green} curve (for example $0.04$ pF) would overshoot the point of first contact on the \textcolor{tab_blue}{blue} curve. This means that after switching a conservative stop condition has to be chosen. \\
+\subsection{Reproducibility}
+Reproducibility of approach curves with regard to different samples and masks is important for the future use of the Mask Aligner. In the master thesis of Jonas Beeker the
+reproducibility of different masks, different locations, different approaches
+and a comparison before and after evaporation were discussed~\cite{Beeker}.
+
+\subsubsection{Reproducibility when removing sample/mask}
+
+One concern regarding reproducibility is whether the approach curve is significantly influenced by swapping or reinserting the mask or sample. This issue can be addressed by creating a calibration approach curve with one sample and then exchanging it for another. This method potentially enables evaporation measurements on samples that have never been in contact with a mask. A first step is to determine this for reinsertion of the same sample.
+
+\begin{figure}[H]
+    \centering
+	\begin{subfigure}{0.495\textwidth}
+    \includegraphics[width=\linewidth]{img/MA/InsertionReproducibility.pdf}
+    \caption{}
+	\label{fig:approach_replicability_cap}
+	\end{subfigure}
+	\begin{subfigure}{0.495\textwidth}
+    \includegraphics[width=\linewidth]{img/MA/InsertionReproducibility_diff.pdf}
+    \caption{}
+	\label{fig:approach_replicability_cap_diff}
+	\end{subfigure}
+	\caption{(\subref{fig:approach_replicability_cap}) 3 subsequent approach curves.  (\subref{fig:approach_replicability_cap_diff}) corresponding differences in capacitance. \textcolor{tab_green}{Green} is the initial curve. The \textcolor{tab_blue}{blue} curve is after sample has been carefully removed and reinserted. For the \textcolor{tab_red}{red} curve the mask was removed and reinserted. Larger fluctuations in the signal visible on the \textcolor{tab_blue}{Blue} curve are due to an accidental change in time constant of the LockIn Amplifier.}
+    \label{fig:approach_replicability}
+\end{figure} 
+
+Reinsertion of the mask resulted in a substantial change in the approach curve, which can likely be attributed to newly induced tilt on the mask. This shift is evident in the difference between the green and red curves shown in Figure \ref{fig:approach_replicability}. \ref{fig:approach_replicability}.
+
+Alternatively, minor movement of the mask frame on the Nd magnets, causing the mask to tilt, could also be a contributing factor. This issue is inherent to the current design of the Mask Aligner and cannot be resolved without a fundamental redesign. \\
+
+Reinsertion of the sample also resulted in a difference in approach curves, although this difference is relatively small, as shown in Figure \ref{fig:approach_replicability} (blue and green curves). The overall trend of the curve remains consistent, but the absolute values exhibit a slight change. However, the peak in dC underwent a significant shift. A stop condition determined based on the green curve (e.g., 0.04 pF) would exceed the point of first contact on the blue curve. This implies that after switching samples, a conservative stop condition must be selected to avoid overshooting. \\
 
 %
 %\subsection{Capacitance correlations} \label{subsec:cross_cap}
@@ -641,13 +653,9 @@ The evaporation of a superconductor onto any material requires a clean sample su
 \begin{enumerate}
 	\item Select chips from a \ce{Si} wafer and place them into a petri dish. Clean the chip
 using acetone and then IPA in an ultrasonic bath.
-	\item Carefully grab a silicon chip with a soft tip tweezer and while
-maintaining stable grip, carefully blow any coarse particles from the surface of the
-chip using pressurized nitrogen. Do not blow the nitrogen at the surface, but
-across it, as otherwise the chip will just fall from the tweezer. Do this for every chip.
-	\item Place the chips in a beaker filled pure acetone and put it in an
-ultrasonic bath. Use the ultrasonic bath for 10 minutes heated to $55^\circ$ C.
-	\item Take the chips out of the acetone with a soft tip tweezer and rinse them with IPA. Then submerge them in a beaker filled with IPA and clean them again in the ultrasonic bath for 10 minutes. No heating required.
+	\item Using a soft-tip tweezer, carefully grasp a silicon chip and maintain a stable grip. Then, gently blow pressurized nitrogen across the surface of the chip to remove any coarse particles. Be careful not to direct the nitrogen stream at the surface, as this may dislodge the chip from the tweezer. Instead, blow the nitrogen across the surface to effectively clean it. Repeat this process for each chip.
+	\item Submerge the silicon chips in a beaker filled with pure acetone and then place the beaker in an ultrasonic bath. Run the ultrasonic bath for 10 minutes at $55^\circ$C.
+	\item Take the chips out of the acetone with a soft tip tweezer and rinse them with IPA. Then submerge them in a beaker filled with IPA and clean them again in the ultrasonic bath for 10 minutes.
 	\item Take the chip out again and repeat the last step with demineralized water. While waiting, combine the hardener and resin of the 2 part epoxy EPO-TEK E4110-LV to ensure it is ready for a later step.
 	\item Take the chip out and blow it dry with pressurized nitrogen, following the same procedure as step 2.
 	\item Place 4 dots of mixed epoxy EPO-TEK E4110-LV into the grooves of the sample holder at the edges. Carefully grab the chip and place it from the top as straight as possible onto the sample holder.
diff --git a/chap03.aux b/chap03.aux
index f706e3c8f1d245534f2a8b7d1629f9797665faf6..0e112097e491cf037342831103259edc0fe872f7 100644
--- a/chap03.aux
+++ b/chap03.aux
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diff --git a/chap04.aux b/chap04.aux
index 7a36e1f6af2bdab6efc5292ebbff5bded6382a88..59dbf3df15ade7ae9cc126e18bd6ab10efac1da7 100644
--- a/chap04.aux
+++ b/chap04.aux
@@ -1,86 +1,85 @@
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 \citation{Olschewski}
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+\newlabel{fig:Z3_reglue_process_dot}{{2.4c}{38}{\relax }{figure.caption.36}{}}
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+\newlabel{fig:Z3_reglue_process_down}{{2.4d}{38}{\relax }{figure.caption.36}{}}
+\newlabel{sub@fig:Z3_reglue_process_down}{{d}{38}{\relax }{figure.caption.36}{}}
+\@writefile{lof}{\contentsline {figure}{\numberline {2.4}{\ignorespaces The re-gluing process shown for the upper left piezo on Z3 that was no longer attached to the Mask Aligner Body. (a) detached piezo. Remains of the EPO-TEK H70E epoxy glue are visible as brown stains on both the Mask Aligner Body and the piezo stack. (b) remains of glue were scratched off carefully. (c) the applied dot of Torr Seal epoxy glue. (d) two nuts and the prism used as weights and alignment tools during curing.}}{38}{figure.caption.36}\protected@file@percent }
+\newlabel{fig:Z3_reglue_process}{{2.4}{38}{The re-gluing process shown for the upper left piezo on Z3 that was no longer attached to the Mask Aligner Body. (a) detached piezo. Remains of the EPO-TEK H70E epoxy glue are visible as brown stains on both the Mask Aligner Body and the piezo stack. (b) remains of glue were scratched off carefully. (c) the applied dot of Torr Seal epoxy glue. (d) two nuts and the prism used as weights and alignment tools during curing}{figure.caption.36}{}}
+\@writefile{lof}{\contentsline {figure}{\numberline {2.5}{\ignorespaces The final glued position of the upper Z3 motor after re-gluing. Red line shows the deviation from the other piezo stack. The angle $\alpha $ is about $ \approx 4.5^\circ \pm 0.5^\circ $.}}{39}{figure.caption.37}\protected@file@percent }
+\newlabel{fig:Z3_after reglue}{{2.5}{39}{The final glued position of the upper Z3 motor after re-gluing. Red line shows the deviation from the other piezo stack. The angle $\alpha $ is about $ \approx 4.5^\circ \pm 0.5^\circ $}{figure.caption.37}{}}
+\@writefile{toc}{\contentsline {section}{\numberline {2.5}Z3 motor}{39}{section.2.5}\protected@file@percent }
+\@writefile{lof}{\contentsline {figure}{\numberline {2.6}{\ignorespaces Step size against screw rotation data obtained to calibrate the screw firmness for Z2 and Z3. Larger x-axis values means less firm screw. \textcolor {tab_blue}{Blue} and \textcolor {tab_orange}{orange} show Z3 before swapping front plate with Z1, \textcolor {tab_green}{green} and \textcolor {tab_red}{red} show after.}}{40}{figure.caption.38}\protected@file@percent }
+\newlabel{fig:Z3_screw_rot}{{2.6}{40}{Step size against screw rotation data obtained to calibrate the screw firmness for Z2 and Z3. Larger x-axis values means less firm screw. \textcolor {tab_blue}{Blue} and \textcolor {tab_orange}{orange} show Z3 before swapping front plate with Z1, \textcolor {tab_green}{green} and \textcolor {tab_red}{red} show after}{figure.caption.38}{}}
+\@writefile{toc}{\contentsline {subsection}{\numberline {2.5.1}Front plate repair}{40}{subsection.2.5.1}\protected@file@percent }
 \citation{Olschewski}
-\@writefile{lof}{\contentsline {figure}{\numberline {2.7}{\ignorespaces Screw rotation calibration data for Z2 and Z3 after front plate repairs.}}{38}{figure.caption.37}\protected@file@percent }
-\newlabel{fig:Z3_screw_rot_after_rep}{{2.7}{38}{Screw rotation calibration data for Z2 and Z3 after front plate repairs}{figure.caption.37}{}}
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-\newlabel{sub@fig:Front_plate_repair_tool}{{a}{39}{\relax }{figure.caption.38}{}}
-\newlabel{fig:Front_plate_repair_plate}{{2.8b}{39}{\relax }{figure.caption.38}{}}
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-\newlabel{fig:Front_plate_repair}{{2.8}{39}{(\subref {fig:Front_plate_repair_tool}) Solidworks explosive diagram of the Z3 front plate with the alignment tool. (\subref {fig:Front_plate_repair_plate}) final front plate assembled}{figure.caption.38}{}}
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-\newlabel{fig:Feedthrough_Repairs_right}{{2.10b}{41}{\relax }{figure.caption.40}{}}
-\newlabel{sub@fig:Feedthrough_Repairs_right}{{b}{41}{\relax }{figure.caption.40}{}}
-\@writefile{lof}{\contentsline {figure}{\numberline {2.10}{\ignorespaces Left (\subref  {fig:Feedthrough_Repairs_left}) and right (\subref  {fig:Feedthrough_Repairs_right}) side of Mask Aligner flange. \textcolor {tab_red}{Red} circles mark the changes made to the grounding.}}{41}{figure.caption.40}\protected@file@percent }
-\newlabel{fig:Feedthrough_Repairs}{{2.10}{41}{Left (\subref {fig:Feedthrough_Repairs_left}) and right (\subref {fig:Feedthrough_Repairs_right}) side of Mask Aligner flange. \textcolor {tab_red}{Red} circles mark the changes made to the grounding}{figure.caption.40}{}}
-\@writefile{lot}{\contentsline {table}{\numberline {2.1}{\ignorespaces The cross capacitance values of mask 1 before and after the optimizations of the feedthrough and capacitance sensor cables.}}{41}{table.caption.41}\protected@file@percent }
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-\newlabel{fig:calibration_after_repair}{{2.11}{42}{The final calibration that was performed, after all the optimizations were done. Driving of the motors was done in 2000, 4000, 6000, 8000 and 10000 steps under ambient conditions}{figure.caption.42}{}}
+\@writefile{lof}{\contentsline {figure}{\numberline {2.7}{\ignorespaces Screw rotation calibration data for Z2 and Z3 after front plate repairs.}}{41}{figure.caption.39}\protected@file@percent }
+\newlabel{fig:Z3_screw_rot_after_rep}{{2.7}{41}{Screw rotation calibration data for Z2 and Z3 after front plate repairs}{figure.caption.39}{}}
+\newlabel{fig:Front_plate_repair_tool}{{2.8a}{42}{\relax }{figure.caption.40}{}}
+\newlabel{sub@fig:Front_plate_repair_tool}{{a}{42}{\relax }{figure.caption.40}{}}
+\newlabel{fig:Front_plate_repair_plate}{{2.8b}{42}{\relax }{figure.caption.40}{}}
+\newlabel{sub@fig:Front_plate_repair_plate}{{b}{42}{\relax }{figure.caption.40}{}}
+\@writefile{lof}{\contentsline {figure}{\numberline {2.8}{\ignorespaces (\subref  {fig:Front_plate_repair_tool}) Solidworks explosive diagram of the Z3 front plate with the alignment tool. (\subref  {fig:Front_plate_repair_plate}) final front plate assembled.}}{42}{figure.caption.40}\protected@file@percent }
+\newlabel{fig:Front_plate_repair}{{2.8}{42}{(\subref {fig:Front_plate_repair_tool}) Solidworks explosive diagram of the Z3 front plate with the alignment tool. (\subref {fig:Front_plate_repair_plate}) final front plate assembled}{figure.caption.40}{}}
+\@writefile{toc}{\contentsline {subsection}{\numberline {2.5.2}Small capacitance stack}{42}{subsection.2.5.2}\protected@file@percent }
+\@writefile{lof}{\contentsline {figure}{\numberline {2.9}{\ignorespaces The measured capacitance values for the piezo stacks of the motor Z3. }}{43}{figure.caption.41}\protected@file@percent }
+\newlabel{fig:Z3_weaker_stack}{{2.9}{43}{The measured capacitance values for the piezo stacks of the motor Z3}{figure.caption.41}{}}
+\@writefile{toc}{\contentsline {section}{\numberline {2.6}Feed through cabling optimizations}{43}{section.2.6}\protected@file@percent }
+\newlabel{fig:Feedthrough_Repairs_left}{{2.10a}{44}{\relax }{figure.caption.42}{}}
+\newlabel{sub@fig:Feedthrough_Repairs_left}{{a}{44}{\relax }{figure.caption.42}{}}
+\newlabel{fig:Feedthrough_Repairs_right}{{2.10b}{44}{\relax }{figure.caption.42}{}}
+\newlabel{sub@fig:Feedthrough_Repairs_right}{{b}{44}{\relax }{figure.caption.42}{}}
+\@writefile{lof}{\contentsline {figure}{\numberline {2.10}{\ignorespaces Left (\subref  {fig:Feedthrough_Repairs_left}) and right (\subref  {fig:Feedthrough_Repairs_right}) side of Mask Aligner flange. \textcolor {tab_red}{Red} circles mark the changes made to the grounding.}}{44}{figure.caption.42}\protected@file@percent }
+\newlabel{fig:Feedthrough_Repairs}{{2.10}{44}{Left (\subref {fig:Feedthrough_Repairs_left}) and right (\subref {fig:Feedthrough_Repairs_right}) side of Mask Aligner flange. \textcolor {tab_red}{Red} circles mark the changes made to the grounding}{figure.caption.42}{}}
+\@writefile{lot}{\contentsline {table}{\numberline {2.1}{\ignorespaces The cross capacitance values of mask 1 before and after the optimizations of the feedthrough and capacitance sensor cables.}}{44}{table.caption.43}\protected@file@percent }
+\newlabel{tab:cross_cap_after_repair}{{2.1}{44}{The cross capacitance values of mask 1 before and after the optimizations of the feedthrough and capacitance sensor cables}{table.caption.43}{}}
+\@writefile{toc}{\contentsline {section}{\numberline {2.7}Final test}{44}{section.2.7}\protected@file@percent }
+\@writefile{lof}{\contentsline {figure}{\numberline {2.11}{\ignorespaces The final calibration that was performed, after all the optimizations were done. Driving of the motors was done in 2000, 4000, 6000, 8000 and 10000 steps under ambient conditions.}}{45}{figure.caption.44}\protected@file@percent }
+\newlabel{fig:calibration_after_repair}{{2.11}{45}{The final calibration that was performed, after all the optimizations were done. Driving of the motors was done in 2000, 4000, 6000, 8000 and 10000 steps under ambient conditions}{figure.caption.44}{}}
 \@setckpt{chap04}{
-\setcounter{page}{43}
+\setcounter{page}{46}
 \setcounter{equation}{0}
 \setcounter{enumi}{4}
 \setcounter{enumii}{0}
@@ -99,8 +98,8 @@
 \setcounter{table}{1}
 \setcounter{section@level}{1}
 \setcounter{Item}{14}
-\setcounter{Hfootnote}{1}
-\setcounter{bookmark@seq@number}{28}
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diff --git a/chap04.tex b/chap04.tex
index 5f181276c2244c6abd1e3e4e2e79711bdf0aa478..09730d7c306b0995c036d219d3b21f4bbefd5bf7 100644
--- a/chap04.tex
+++ b/chap04.tex
@@ -36,21 +36,21 @@ The nomenclature for the piezo motors used in the following is described in Figu
 %Only materials that have been cleared for use in UHV environments should be used. Especially materials that leave residues, like adhesive tapes, should be chosen with this in mind. 
 
 \subsection{UHV compatible Soldering}
-When soldering any part that is exposed to UHV only solder tins, which are cleared for use in UHV environments, should be used. \\
-Since flux can splash when heated, surrounding components have to be shielded.
-The used flux has to be cleaned off to avoid outgassing as well as short-circuiting from stray flux. The following steps have to be followed:
+When soldering components for UHV environments, it is essential to use solder tins that are specifically cleared for UHV use.
+To prevent damage to surrounding components, they must be shielded from potential flux splashes during the soldering process.
+After soldering, it is crucial to thoroughly clean the area to prevent outgassing and short-circuiting from stray flux. The following steps should be followed:
 \begin{enumerate}
-	\item Using laboratory cleaning swabs and demineralized water mixed with laboratory detergent the surface that was solder on should be cleaned thoroughly, but carefully. After cleaning with the laboratory swab, rinse the surface.
-	\item The previous step should be repeated with demineralized water without any detergent
-	\item Rinse the surface with IPA to wash off water residue 
-	\item Remove the IPA residue with a heat gun. The heat gun should be set no higher than $80^\circ$ C and held about $10$ cm away from any components to avoid overheating. 
+	\item Clean the soldered surface thoroughly using laboratory cleaning swabs and a mixture of demineralized water and laboratory detergent. Rinse the surface after cleaning.
+	\item Repeat the previous step with demineralized water without any detergent.
+	\item Rinse the surface with isopropyl alcohol (IPA) to remove any water residue.
+	\item Use a heat gun to remove the IPA residue, setting the temperature to no higher than $80^\circ$ C and maintaining a distance of about $10$ cm from any components to avoid overheating.
 \end{enumerate}
 
 \section{Soldering anchors} \label{ch:solder_anchors}
-The soldering anchor points that were previously used on the Mask Aligner are small ($2$ mm x $2$ mm x $6$ mm) \ce{Al2O3} ceramic pieces onto which a small piece of copper, pre-coated with solder, was glued using non-conductive EPO-TEK H70E. All cables coming from the piezo motors can be soldered to this soldering anchor. This allows usage of shorter cables and for the cables to be more cleanly routed. The Ceramic piece was glued to the surface of the Mask Aligner using the same glue.\\
+The original soldering anchor points on the Mask Aligner consisted of small ($2$ mm x $2$ mm x $6$ mm) \ce{Al2O3}  ceramic pieces with a pre-coated copper piece glued to them using non-conductive EPO-TEK H70E.This copper piece was coated with solder, allowing cables from the piezo motors to be soldered directly to the anchor point. This design enabled the use of shorter cables and facilitated a cleaner cable routing. The ceramic piece was then attached to the surface of the Mask Aligner using the same EPO-TEK H70E glue. \\
 
-EPO-TEK H70E is recommended to cure at $150$°C for at least 1 hour. For repairs it would be difficult and dangerous to heat the entire Mask Aligner to $150$°C, since the piezo stacks depolarize at temperatures near $150$°C. It is also difficult to heat the glue locally to $150$°C. Due to this it was determined that a different glue should be used. \\
-Torr Seal was determined to have all the necessary qualities and was used as a replacement universally. Torr Seal is a two component epoxy, that can cure at room temperature. It fulfills UHV outgassing requirements~\cite{torr_seal}. It however has the disadvantage of reaching its flash point at $175$°C. For this reason soldering on anything affixed with Torr Seal should be done with care as prolonged exposure to the heat of a soldering iron will lead to deterioration. Also of note is that Torr Seal cannot operate at temperatures below $-45$°C, so usage in a very low temperature environment is no longer possible. \\ 
+EPO-TEK H70E is typically cured at $150^\circ$C for at least one hour. However, this temperature requirement posed a challenge for repairs on the Mask Aligner, as the piezo stacks depolarize at temperatures near $150^\circ$C. Additionally, it was difficult to heat the glue locally to $150^\circ$C without affecting the surrounding components. \\
+As a result, an alternative glue was sought. Torr Seal was identified as a suitable replacement, offering the necessary qualities for the application. It is a two-component epoxy that can cure at room temperature and meets UHV outgassing requirements. However, Torr Seal has some limitations: it reaches its flash point at $175^\circ$C, which means that soldering on components affixed with Torr Seal requires caution to avoid deterioration from prolonged heat exposure. Furthermore, Torr Seal is not suitable for use in extremely low-temperature environments, as it cannot operate below $-45^\circ$C. \\
 
 \begin{figure}[H]
     \centering
@@ -78,15 +78,15 @@ Torr Seal was determined to have all the necessary qualities and was used as a r
     \label{fig:solder_anchors_diagram}
 \end{figure}
 
-Over time the glue on some of the soldering anchors had deteriorated. The solder dots were not held in place anymore. Sometimes this caused additional friction with the Sapphire Prism, which caused the mask stage to frequently get stuck. The Problem situation is depicted in Figure (\ref{fig:solder_anchors_diagram_base}).
-This problem would culminate in the motor Z1 getting completely stuck, when driven down to mask extraction height. \\
+Over time, the glue on some soldering anchors deteriorated, causing the solder dots to become dislodged. This led to increased friction with the Sapphire Prism, resulting in the mask stage frequently getting stuck. The issue is illustrated in Figure (\ref{fig:solder_anchors_diagram_base}). In severe cases, the motor Z1 would become completely stuck when attempting to lower it to the mask extraction height. \\
 
-In order to optimize this behavior, the following 3 actions are possible.
-First, the size of the solder joint on the anchor can be reduced until it no longer interferes. This process often involved re-soldering the respective cable, since carving away material without disconnecting the cable often proved impossible. This was done when the anchor has not lost adhesion to the MA body. This is pictured in Figure (\ref{fig:solder_anchors_diagram_SmallerDot}). \\
+In order to optimize this behavior, the following 3 actions are possible:
+\begin{itemize}
+	\item Reducing the size of the solder joint on the anchor until it no longer interferes. This often requires re-soldering the respective cable, as carving away material without disconnecting the cable can be difficult. This method is used when the anchor has not lost adhesion to the MA body. This is pictured in Figure (\ref{fig:solder_anchors_diagram_SmallerDot}).
+	\item Replace the soldering anchor with a $1$ mm \ce{Al2O3} thick plate.This allows for a larger solder dot before interference occurs. This procedure is used when the solder ceramic is no longer securely attached to the Mask Aligner body (\ref{fig:solder_anchors_diagram_AlO}). 
+	\item  Gluing the soldering anchor to the top or bottom side of the ceramic. It is essential to ensure the glue layer between the Mask Aligner walls and the anchor is thick enough for proper insulation. Although this solution is not ideal, it was used as a quick optimization, allowing the functional solder anchor to be reused without detaching all cables. This is shown in Figure (\ref{fig:solder_anchors_diagram_GlueTop}).
+\end{itemize}
 
-Another procedure is to completely replace the soldering anchor with a $1$ mm \ce{Al2O3} thick plate. The size of the solder dot can in this case be quite large before interfering. When the solder ceramic was no longer attached sufficiently to the Mask Aligner body this procedure is used (\ref{fig:solder_anchors_diagram_AlO}). \\ 
-
-The third procedure is to glue the soldering anchor on the top/bottom side of the ceramic. Care has to be taken that the layer of glue between the walls of the Mask Aligner and the anchor is thick enough to provide proper insulation. This last solution is inelegant, but was used as a quick optimization. The functional solder anchor could often be reused without having to detach all cables. This can be seen in Figure (\ref{fig:solder_anchors_diagram_GlueTop}). \\
 
 \begin{figure}[H]
     \centering
@@ -118,12 +118,12 @@ The third procedure is to glue the soldering anchor on the top/bottom side of th
     \label{fig:solder_anchors_examples}
 \end{figure}
 
-Examples for all the different measures taken on the Mask Aligner can be seen in Figure \ref{fig:solder_anchors_examples}
-All motors were checked for soldering anchor points that could potentially interfere with the prism. One of these actions was taken for all ceramics where problems could be found. An example for a problematic anchor is shown in Figure \ref{fig:solder_anchors_examples_shear_01}. The state after taking of some of the solder is shown in Figure \ref{fig:solder_anchors_examples_shear_02}\\
-After these repairs, the prisms would no longer get stuck when driving and could move the whole range of possible motion. Not all ceramics were replaced and deterioration of the glue is likely to cause similar problems in the future. To ensure correct driving it is recommended that all solder ceramics should be replaced. This however goes beyond the scope of this thesis. \\
+Examples of the various measures taken on the Mask Aligner can be seen in Figure \ref{fig:solder_anchors_examples}. All motors were inspected for soldering anchor points that could potentially interfere with the prism, and corrective action was taken for all problematic ceramics. For instance, a problematic anchor is shown in Figure \ref{fig:solder_anchors_examples_shear_01}, and the result after removing some of the solder is shown in Figure \ref{fig:solder_anchors_examples_shear_02}. \\
+
+Following these repairs, the prisms no longer got stuck during movement and could move freely within their full range of motion. However, not all ceramics were replaced, and it is likely that future problems will arise due to glue deterioration. To ensure reliable operation, it is recommended that all solder ceramics be replaced, although this is beyond the scope of this thesis. \\
 
 \section{Piezo regluing} \label{sec:piezo_reglue}
-The piezo stacks in the Mask Aligner were also glued in 2015 with the non-conductive EPO-TEK H70E glue~\cite{Olschewski}. For this reason, $2$ of the piezo stacks, one on motor Z1 and one on Motor Z3, had completely detached. These stacks needed to be reglued to the Mask Aligner Body. \\
+The piezo stacks in the Mask Aligner were glued using non-conductive EPO-TEK H70E glue in 2015~\cite{Olschewski}. As a result, two of the piezo stacks, one on motor Z1 and one on motor Z3, had completely detached from the Mask Aligner Body. These stacks required reattachment to the Mask Aligner Body. \\
 
 \begin{figure}[H]
     \centering
@@ -155,10 +155,12 @@ The piezo stacks in the Mask Aligner were also glued in 2015 with the non-conduc
     \label{fig:Z3_reglue_process}
 \end{figure}
 
-Torr Seal was used again. Tests and the data sheet showed that Torr Seal has similar elastic properties to H70E. The right size for a glue dot was determined via testing of spread and comparison with previous glue dot size. These properties needed to be determined so that the piezo could be attached in proper alignment with the surrounding piezos.\\
+Torr Seal was used to reattach the piezo stacks, as tests and the data sheet indicated it had similar elastic properties to the original H70E glue. The optimal size for the glue dot was determined through testing and comparison with the previous glue dot size, ensuring proper 
+alignment with the surrounding piezos. \\
 
-To perform the actual gluing of the piezo stack, all traces of remaining glue were scratched off the surface of the affected piezo stack (Fig. \ref{fig:Z3_reglue_process_scratched}). Afterward a small dot of Torr Seal was put on the underside of the piezo stack, and it was carefully put in place (Fig. \ref{fig:Z3_reglue_process_dot}). The Mask Aligner was rotated with a clamp so that gravity kept the piezo stack in the place. In order to provide pressure on the piezo stack, the prism was reinserted into the motor and was weighed down. (Fig. \ref{fig:Z3_reglue_process_down}). The entire process can be seen in Figure \ref{fig:Z3_reglue_process}.\\ 
-The repair of the piezo on motor Z1 happened without problems, but on motor Z3 the piezo turned by about $\approx 4.5^\circ \pm 0.5^\circ$ during the curing process. From geometrical consideration ($\cos(4.5^\circ) \approx 0.996$) this should affect the performance by less than $0.5$ \%.
+To glue the piezo stack, the affected area was first cleaned by scratching off any remaining glue (Fig. \ref{fig:Z3_reglue_process_scratched}). A small dot of Torr Seal was then applied to the underside of the piezo stack, and it was carefully positioned in place (Fig. \ref{fig:Z3_reglue_process_dot}). The Mask Aligner was rotated to hold the piezo stack in position, and the prism was reinserted and weighed down to apply pressure (Fig. \ref{fig:Z3_reglue_process_down}). The entire process is illustrated in Figure \ref{fig:Z3_reglue_process}.
+
+The repair of the piezo on motor Z1 was successful, but on motor Z3, the piezo rotated by approximately $\approx 4.5^\circ \pm 0.5^\circ$ during the curing process. However, based on geometrical consideration ($\cos(4.5^\circ) \approx 0.996$) this should affect the performance by less than $0.5$ \%.
 
 \begin{figure}[H]
     \centering
@@ -168,7 +170,7 @@ The repair of the piezo on motor Z1 happened without problems, but on motor Z3 t
 \end{figure}
 
 \section{Z3 motor}
-After repairs, the motors Z1 and Z2 were performing as expected, but the motor Z3 would occasionally drive with reduced step size. The step size of motor Z3 would occasionally drop by approximately one half. This happened randomly. Additionally, the ratio of approach/retract speed was much higher for Z3 than for Z1/Z2 ($2$ instead of $1.25$), regardless of screw configuration. This behavior can be seen in Figure \ref{fig:Z3_screw_rot} (compare \textcolor{tab_blue}{blue} and \textcolor{tab_orange}{orange} to \textcolor{tab_purple}{purple} and \textcolor{tab_brown}{brown}).
+Following the repairs, motors Z1 and Z2 functioned as expected, but motor Z3 exhibited intermittent issues with reduced step size. Specifically, the step size of motor Z3 would occasionally decrease by approximately half, occurring randomly. Furthermore, the approach/retract speed ratio of motor Z3 was significantly higher than that of motors Z1 and Z2, with a ratio of $2$ compared to $1.25$, regardless of the screw configuration. This behavior is illustrated in Figure \ref{fig:Z3_screw_rot}, where the blue and orange lines are compared to the purple and brown lines. \\
 
 \begin{figure}[H]
     \centering
@@ -177,15 +179,15 @@ After repairs, the motors Z1 and Z2 were performing as expected, but the motor Z
     \label{fig:Z3_screw_rot}
 \end{figure}
 
-This led to the conclusion that Z3 had some sort of alignment issue. Sometimes randomly all the motors were in line with the prism and could drive at the appropriate power, while sometimes one of the motors would lose contact with the prism. 
-The cause of this was hypothesized to be the front plate of the Z3 motor. For this reason, the front plate had to be repaired.
+This led to the conclusion that motor Z3 had an alignment issue. It appeared that the motors would occasionally align properly with the prism, allowing them to drive at the correct power, but at other times, one of the motors would lose contact with the prism, resulting in reduced performance.\\
+The suspected cause of this issue was the front plate of the Z3 motor. As a result, it was determined that the front plate needed to be repaired to resolve the alignment problem.\\
 
 \subsection{Front plate repair}
 In order to test the hypothesis, that the front plate of motor Z3 was causing the issues, the front plate of Z3 was exchanged for the front plate of motor Z1. Re-soldering all the cables of the front plate to the solder anchors, in order to swap plates, would put the glue of the solder anchors at risk of failing. In order to prevent these risks, new longer copper cables were created and the front plate of Z3 was directly connected to the vacuum feedthrough pins. After the plates were swapped the issues with motor Z3 were no longer observed (Fig. \ref{fig:Z3_screw_rot} \textcolor{tab_green}{green} and \textcolor{tab_red}{red} against \textcolor{tab_blue}{blue} and \textcolor{tab_orange}{orange}). \\
 
 The performance of Z3 became more in line with the other $2$ motors. The performance was in the firmer screw regime lower than that of Z2. In the regime of normal operation (about 2-3 screw rotation in Figure \ref{fig:Z3_screw_rot_after_rep}) the performance became similar (Fig. \ref{fig:Z3_screw_rot}). \\ %The difference in this regime was determined to be not significant enough to require any more intervention. \\
 
-The problem on the Z3 front plate was a misalignment on one of the piezo stacks on the plate, leading to it shifting over time. To check for the unevenness of the surface, tests were performed, where the top of the piezo stacks was coated with color and then the plate was placed on a \ce{Al3O2} plate and moved in motor movement direction. This test was performed for both motor movement directions and repeated several times. For all cases, the color remained on the same piezo, suggesting improper alignment. \\
+The issue with the Z3 front plate was identified as a misalignment of one of the piezo stacks, which caused it to shift over time. To investigate the unevenness of the surface, a series of tests were conducted. In these tests, an \ce{Al2O3} plate was coated with color, and the Z3 front plate was placed on top of it, with the piezo stacks facing the \ce{Al2O3} plate and aligned to be flat. The plate was then moved in the direction of motor movement. This test was performed for both motor movement directions and repeated multiple times. In all cases, color was transferred to the same piezo stack, indicating that the alignment was indeed improper. \\
 
 \begin{figure}[H]
     \centering
@@ -194,14 +196,15 @@ The problem on the Z3 front plate was a misalignment on one of the piezo stacks
     \label{fig:Z3_screw_rot_after_rep}
 \end{figure}
 
-The piezo stacks were taken off the front plate. Two of the ten replacement piezos were glued to the surface of the old steel plate. An alignment tool was produced by the workshop. A Solidworks image of the alignment tool can be seen in Figure \ref{fig:Front_plate_repair_tool} \\
-EPO-TEK H70E was used to glue the piezos, since this was done for the other front plates in the past~\cite{Olschewski}. \\
+The piezo stacks were removed from the front plate. Two of the ten replacement piezos were then attached to the surface of the old steel plate using EPO-TEK H70E glue, which had been used previously for the other front plates. To ensure accurate alignment, a custom alignment tool was created by the workshop. A Solidworks image of this tool can be seen in Figure \ref{fig:Front_plate_repair_tool}~\cite{Olschewski}. \\
 
-Unfortunately during the repairs it was not noticed that the replacement piezos were not identical to the old ones. Both sides of the old piezos were polished, so that they can be used as sliding surfaces, but the replacement piezos have only one sliding surface. This can be seen in the different texture of the top and bottom piezo stacks in Figure \ref{fig:Front_plate_repair_plate}. \\
+During the repair process, it was overlooked that the replacement piezos were not identical to the original ones. The old piezos had both sides polished, allowing them to be used as sliding surfaces, whereas the replacement piezos had only one polished surface. This difference is evident in the varying texture of the top and bottom piezo stacks, as shown in Figure \ref{fig:Front_plate_repair_plate}.\\
 
 The solder ceramics on the front plate had to be detached for the creation of the new front plate, as the alignment tool was designed without them in mind. This was not an issue however as they had similar problems to the other solder ceramics in previous sections. The ceramics were replaced with a long \ce{Al2O3} plate, which was attached using Torr Seal. The results can be seen in Figure \ref{fig:Front_plate_repair_plate}. \\
 
-While testing the newly made front plate, the performance of Z3 was comparable with Z2, although it had a larger deviance between approach and retract movement and a decreased performance for very firm screw configuration (Fig. \ref{fig:Z3_screw_rot_after_rep}). Regardless, the difference in performance was deemed to be insignificant as a point of common step size could be found (Fig. \ref{fig:Z3_screw_rot_after_rep}). In the range of 2.5 screw rotations the performance matched between Z2 and Z3 and thus this screw setting was chosen for optimization of these 2 motors. Z1 was then compared to both motors and a similar screw setting was chosen for it as well. 
+During testing of the newly fabricated front plate, the performance of motor Z3 was comparable to that of motor Z2, although it exhibited a slightly larger deviation between approach and retract movements and reduced performance with very firm screw configurations (Fig. \ref{fig:Z3_screw_rot_after_rep}). However, the difference in performance was considered negligible, as a common step size could be identified (Fig. \ref{fig:Z3_screw_rot_after_rep}). Within a range of $2.5$ screw rotations, the performance of Z2 and Z3 matched, and this screw setting was selected for optimization of these two motors. Subsequently, motor Z1 was compared to both Z2 and Z3, and a similar screw setting was chosen for it as well.
+
+%While testing the newly made front plate, the performance of Z3 was comparable with Z2, although it had a larger deviance between approach and retract movement and a decreased performance for very firm screw configuration (Fig. \ref{fig:Z3_screw_rot_after_rep}). Regardless, the difference in performance was deemed to be insignificant as a point of common step size could be found (Fig. \ref{fig:Z3_screw_rot_after_rep}). In the range of 2.5 screw rotations the performance matched between Z2 and Z3 and thus this screw setting was chosen for optimization of these 2 motors. Z1 was then compared to both motors and a similar screw setting was chosen for it as well. 
 
 \begin{figure}[H]
     \centering
@@ -224,9 +227,14 @@ While testing the newly made front plate, the performance of Z3 was comparable w
 The new cables were bend and glued in place with Torr Seal to avoid interfering with the sample/mask insertion path and the camera.
 
 \subsection{Small capacitance stack}
-During the investigation of the Z3 motor, the capacitance values for the piezo stacks of the Z3 motors were measured. The motor that was reglued in Section \ref{sec:piezo_reglue} has a lower capacitance value than the surrounding piezo stacks. The value ($1.05$ nF) is lower by approximately the amount a single piezo layer ($0.4$ nF) has. The different capacitances measured for all the piezo stacks can be seen in Figure \ref{fig:Z3_weaker_stack}. The piezo stacks both showing $1.62$ nF were only measured together since they were always wired in parallel. The plate stacks were also only measured together. \\
+During the investigation of the Z3 motor, the capacitance values of the piezo stacks were measured. Notably, the motor that was reglued (Section \ref{sec:piezo_reglue}) had a lower capacitance value ($1.05$ nF) compared to the surrounding piezo stacks, with a difference of approximately $0.4$ nF, which is equivalent to the capacitance of a single piezo layer. The measured capacitances of all the piezo stacks are shown in Figure \ref{fig:Z3_weaker_stack}. It's worth noting that the two piezo stacks with a capacitance of $1.62$ nF were measured together, as they were always wired in parallel, and the same applies to the plate stacks.
 
-This indicates, that one of the piezo layers depolarized. This could cause the deviation in the driving behavior of Z3 at low screw firmness. It should be born in mind since it might cause problems with Z3 in the future. It might also be the reason Z3 is more prone to failures.
+These findings suggest that one of the piezo layers may have depolarized, which could be the cause of the deviation in the driving behavior of Z3 at low screw firmness. This issue should be taken into consideration, as it may lead to problems with Z3 in the future and could also be the reason why Z3 is more prone to failures.
+
+%
+%During the investigation of the Z3 motor, the capacitance values for the piezo stacks of the Z3 motors were measured. The motor that was reglued in Section \ref{sec:piezo_reglue} has a lower capacitance value than the surrounding piezo stacks. The value ($1.05$ nF) is lower by approximately the amount a single piezo layer ($0.4$ nF) has. The different capacitances measured for all the piezo stacks can be seen in Figure \ref{fig:Z3_weaker_stack}. The piezo stacks both showing $1.62$ nF were only measured together since they were always wired in parallel. The plate stacks were also only measured together. \\
+%
+%This indicates, that one of the piezo layers depolarized. This could cause the deviation in the driving behavior of Z3 at low screw firmness. It should be born in mind since it might cause problems with Z3 in the future. It might also be the reason Z3 is more prone to failures.
 
 \begin{figure}[H]
     \centering
@@ -236,7 +244,7 @@ This indicates, that one of the piezo layers depolarized. This could cause the d
 \end{figure}
 
 \section{Feed through cabling optimizations}
-A last step of optimization that was performed was on the feedthrought cables. The cables for the capacitance signals are coaxial cables with a shielding to prevent stray capacitances. Only one of the cables shieldings was grounded on the feedthrough side. The length also made insertion into UHV more difficult since the cable could easily be caught behind the copper gaskets. The shielding was instead grounded on the Mask Stage side to the Mask Aligner Body. The shielding was also stripped from a large part of the cable exposing it unnecessarily.
+As a final optimization step the cables for the capacitance signals were examined. They are coaxial cables with a shielding to prevent stray capacitances. Of the four cables only one shielding was grounded on the feedthrough side. The shielding was instead grounded on the Mask Stage side, connecting it to the Mask Aligner Body. The length also made insertion into UHV more difficult since the cable could easily be caught behind the copper gaskets. Additionally, a significant portion of the shielding was stripped, leaving the cable unnecessarily exposed.
 
 \begin{figure}[H]
     \centering
@@ -273,7 +281,7 @@ Mask 1 after  & $7.11 \pm 0.03$      & $3.37 \pm 0.14$       & $0.06 \pm
 Afterward, changes in stray capacitance were measured and compared to measurements taken before. As can be seen in Table \ref{tab:cross_cap_after_repair} the change in cabling did not affect the capacitance values as the differences between them are well within the uncertainty. Regardless, this change does provide an improvement in cable management and possibly reduces the amount of points of failure for the system.  
 
 \section{Final test}
-In order to determine the proper screw setup and to test the function of the changes made to the Mask Aligner, a calibration was performed. 
+To establish the optimal screw setup and verify the effectiveness of the modifications made to the Mask Aligner, a calibration was carried out.
 
 \begin{figure}[H]
     \centering
@@ -282,5 +290,6 @@ In order to determine the proper screw setup and to test the function of the cha
     \label{fig:calibration_after_repair}
 \end{figure}
 
-This calibration shows similarity of performance between the 3 motors in the approach direction, as shown in Figure \ref{fig:calibration_after_repair}. In approach direction the deviation between Z2 and the other motors is within $2$$\sigma$. Between Z3 and Z1 it deviates by up to $6$ nm/step, which is within $6$$\sigma$ of each other. Assuming a difference of $6 nm$, as the worst case, the data gives an angular tilt per step of $\approx (5.73 \times 10^{-6})^\circ$. This is a difference in height on the sample of $\approx 0.5$ nm/step. In turn this would give a difference in penumbra of $1.2$ nm for every $100$ steps.\\
-In the retract direction, the difference between motors is within the margin of error for Z2 and Z1, but Z3 deviates by about $4 \sigma$ from the others. Since the mask is aligned during approach, deviations in retract affect alignment less. After each evaporation, the mask is retracted to about $50$ $\mu$m. This ensures movement of the x piezo does not damage the sample. Therefore, a tilt of $1.2$ $\mu$m would appear over the evaporation field, which corresponds to an angle of $\approx 0.004^\circ$. This difference results in a deviation of $\approx 38$ nm in penumbra. By driving the Z1 and Z2 motors $100$ steps up after the retraction this can be compensated almost fully and should result in an error of at most $\approx 6$ nm of additional penumbra induced by tilt. \\
+The calibration results, as shown in Figure \ref{fig:calibration_after_repair}, indicate that the three motors exhibit similar performance in the approach direction. The deviation between Z2 and the other motors is within $2\sigma$, while the difference between Z3 and Z1 is up to $6$ nm/step, which is within $6\sigma$ of each other. Assuming a worst-case difference of $6$ nm, the data suggests an angular tilt per step of approximately $(5.73 × 10^-6)^circ$. This corresponds to a height difference on the sample of approximately $0.5$ nm/step, resulting in a penumbra difference of $1.2$ nm for every $100$ steps. \\
+In the retract direction, the difference between motors is within the margin of error for Z2 and Z1, but Z3 deviates by about $4\sigma$ from the others. However, since the mask is aligned during approach, deviations in retract have a lesser impact on alignment. After each evaporation, the mask is retracted to approximately $50$ $\mu$m to prevent damage to the sample. This results in a tilt of $1.2$ $\mu$m over the evaporation field, corresponding to an angle of approximately $0.004^\circ$. This difference would cause a deviation of approximately $38$ nm in penumbra. However, by driving the Z1 and Z2 motors $100$ steps up after retraction, this deviation can be almost fully compensated, resulting in an error of at most approximately $6$ nm of additional penumbra induced by tilt. \\
+
diff --git a/chap05.aux b/chap05.aux
index d0a51e3eb7871cf657ff468fc6db9a791ff68b08..e84a9cd314b242995e0b8f7ab88c56cc7f1c55da 100644
--- a/chap05.aux
+++ b/chap05.aux
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 \citation{Simon}
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 \citation{Bhaskar}
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 \citation{grain_growth}
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diff --git a/chap05.tex b/chap05.tex
index 72b9f3d73e2928a441790e541c2373be318e48f6..db17b28b5954a1f43df70b439dbd7fea4759aa6a 100644
--- a/chap05.tex
+++ b/chap05.tex
@@ -2,9 +2,9 @@
 \chapter{Evaporations and measurement}
 \section{Evaporation configuration}
 
-As a test for alignment and to optimize the penumbra of \ce{Pb} islands on a \ce{Si} sample, evaporations were performed on a \ce{Si} sample. The \ce{Si}(111) sample was prepared and cleaned using the process described in Section \ref{sec:sample_prep}. The cleanliness of the sample and mask was confirmed optically before insertion into the Load Lock. Five evaporations were performed to determine edge sharpness of evaporated dots at different distances.
+To optimize the penumbra of Pb islands on a \ce{Si} sample, a series of evaporations were performed. The \ce{Si}(111) sample was prepared and cleaned according to the process described in Section \ref{sec:sample_prep}. The cleanliness of both the sample and mask was confirmed optically before they were inserted into the Load Lock.
 
-Measurements were started at a distance of $25 \pm 5$ $\mu$m from the sample. The approach curve to full contact was recorded and the first evporation was performed in this full contact. The approach curve is shown in Figure \ref{fig:evaporation_approach_curve}.
+Five evaporations were conducted to assess the edge sharpness of the evaporated dots at different distances. The measurements began at a distance of $25 \pm 5$ $\mu$m from the sample. The approach curve to full contact was recorded, and the first evaporation was performed at this point of full contact. The approach curve is shown in Figure \ref{fig:evaporation_approach_curve}.
 
 \begin{figure}[H]
     \centering
@@ -13,9 +13,9 @@ Measurements were started at a distance of $25 \pm 5$ $\mu$m from the sample. Th
     \label{fig:evaporation_approach_curve}
 \end{figure}
 
-The 3 capacitance sensors appear heavily correlated and the uncertainty on C2 and C3 is an order of magnitude larger than the step in $dC$. For this reason C1 was primarily used for alignment. C2 and C3 were recorded but went unused. The other evaporations were performed by retracting the mask $1000$ steps and approaching. 
+The 3 capacitance sensors appear heavily correlated and the uncertainty on C2 and C3 is an order of magnitude larger than the step in $dC$. For this reason C1 was primarily used for alignment. C2 and C3 were recorded but not utilized. The other evaporations were performed by retracting the mask $1000$ steps and approaching. 
 
-Four subsequent evaporations were performed at different lateral positions on the sample. Each evaporation consists of a $9 \times 9$ field of $3$ $\mu$m \ce{Pb} circles, as seen previously in Figure \ref{fig:mask_aligner_nomenclature_capacitances_mask}. Each field was evaporated at different mask sample distances, as described by the approach curve. The evaporations were performed with the following stop conditions: \\  
+The subsequent evaporations were performed by retracting the mask $1000$ steps and then approaching the sample. Four additional evaporations were conducted at different lateral positions on the sample. Each evaporation consisted of a $9 \times 9$ field of $3$ $\mu$m Pb circles, as previously shown in Figure \ref{fig:mask_aligner_nomenclature_capacitances_mask}. Each field was evaporated at different mask-sample distances, as described by the approach curve. The evaporations were performed with the following stop conditions:
 
 \begin{itemize}
 	\item Field 1: $1$ $\mu$m distance to sample (Full contact)
@@ -42,15 +42,15 @@ The parameters used for the evaporator are shown in Appendix \ref{app:evaporatio
 		\label{fig:Evaporation_diagramm_mask_img}
 	\end{subfigure}
     
-    \caption{(\subref{fig:Evaporation_diagramm_sample_img}) diagram showing the Evaporation performed on the sample. Red squares represent the positions of the evaporated fields. The number shows the order of evaporations. Distances are measured using an optical microscope. Fields are at a $10^\circ$ angle with respect to the sample holder. (\subref{fig:Evaporation_diagramm_mask_img}) microscope image of the mask taken before evaporation. The mask holder is placed straight in the microscope. The mask itself is angled on the mask holder.}
+    \caption{(\subref{fig:Evaporation_diagramm_sample_img}) diagram showing the Evaporation performed on the sample. Red squares represent the positions of the evaporated fields. The number shows the order of evaporations. Distances are measured using an optical microscope. Fields are at a $10^\circ$ angle with respect to the sample holder. (\subref{fig:Evaporation_diagramm_mask_img}) microscope image of the mask taken before evaporation. The mask holder was aligned with respect to the camera view.}
     \label{fig:Evaporation_diagramm}
 \end{figure}
 
-After each evaporation the sample was moved laterally by $5000$ steps. First in -x direction and after the third evaporation in +x direction. The positions of the final fields on the sample are shown in Figure \ref{fig:Evaporation_diagramm_sample_img}. \\
-The fields angle was measured to be about $10^\circ$ with regard to the sample edge. This comes from a slight misalignment of the mask on the mask holder, as seen in Figure \ref{fig:Evaporation_diagramm_mask_img}.
+After each evaporation the sample was moved laterally by $5000$ steps. Initially, the movement was in the -x direction, and after the third evaporation, the direction was reversed to +x. The final positions of the fields on the sample are shown in Figure \ref{fig:Evaporation_diagramm_sample_img}. \\
+The fields were found to be angled at approximately 10° with respect to the sample edge. This misalignment is attributed to a slight deviation in the mask's positioning on the mask holder, as evident in Figure \ref{fig:Evaporation_diagramm_mask_img}.
 
 \section{Contamination}
-The entire sample's surface is contaminated with small particles, which are about $\approx 50$ nm in height with a diameter on the order of $ 10$ nm. The contaminants are not visible in an optical microscope. After cleaning, the sample was only checked optically, which is why it is unknown if they were present after cleaning or were deposited afterward. 
+The entire surface of the sample is contaminated with small particles, approximately $50$ nm in height and $10$ nm in diameter. These contaminants are not visible under an optical microscope. Although the sample was cleaned, it was only inspected optically after cleaning, so it is unclear whether the contaminants were present after cleaning or were deposited later.
 
 \begin{figure}[H]
     \centering
@@ -73,11 +73,11 @@ The entire sample's surface is contaminated with small particles, which are abou
 The data in Figure \ref{fig:evaporation_contamination} shows that the particles are up to $\approx 40$ nm in height and with an average height of $24 \pm 10$ nm. The particle's average width is $40 \pm 10$ nm. Height and width were obtained by fitting flattened Gaussian functions to the particles line cuts and extracting $2\sigma$ as well as the height of the peak. The distribution of particles across the sample surface is isotropic.
 
 In addition, the sample was contaminated with larger particles possibly from long exposure at atmospheric conditions as well as being inside the Mask Aligner Chamber during vacuum bakeout, where the system was heated to $>100$°C for several days on $2$ separate occasions. The size of these larger particles was determined to be in the order of $\mathcal{O}(100 \text{nm})$ using SEM and on the order of $\mathit{O}(10)$ $\mu$m in diameter. \\
-Since the sample was checked only optically before insertion into UHV the small particle contamination might have been overlooked. Therefore the sample should be checked for contaminations via AFM before insertion into the chamber.
+As the sample was only inspected optically before being inserted into the UHV chamber, it is possible that the small particle contamination was not detected. To avoid this issue in the future, it is recommended that the sample be examined for contaminants using AFM before being inserted into the chamber.
 
 \section{Penumbra}
 
-In AFM measurements it becomes clear, that the dots are not entirely circular (Fig. \ref{fig:penumbra_tilt_sigmas}). This can potentially come from a tilted mask (see Figure \ref{fig:penumbra_explanation_tilt}). Due to the elliptical abberation visible on the dots two different penumbra widths were analyzed. These are named $\sigma_s$ and $\sigma_l$. Both are defined along the major axis of the elliptical abberation. Additionally, the angle of tilt and the semi major and semi minor axis of the ellipse were measured. An example of how this would look can be seen in Figure \ref{fig:penumbra_tilt_sigmas} \\
+AFM measurements reveal that the dots are not circular (Fig. \ref{fig:penumbra_tilt_sigmas}). This deviation from circularity could be attributed to a tilted mask (as illustrated in Figure \ref{fig:penumbra_explanation_tilt}). Due to the elliptical aberration visible on the dots, two different penumbra widths were analyzed, denoted as $\sigma_s$ and $\sigma_l$. Both of these widths are defined along the major axis of the elliptical aberration. Additionally, the angle of tilt and the semi-major and semi-minor axes of the ellipse were measured. An example of how these measurements were taken can be seen in Figure \ref{fig:penumbra_tilt_sigmas}. \\
 
 \begin{figure}[H]
     \centering
@@ -96,9 +96,9 @@ In AFM measurements it becomes clear, that the dots are not entirely circular (F
     \label{fig:penumbra_tilt_sigmas_and_field_show}
 \end{figure}
 
-AFM measurements were performed to characterize the surface of the evaporated sample. Each field was studied by taking low resolution measurements of the lower left and the upper right side of the field. A few \ce{Pb} dots, representative of the edges and the center of the field were chosen for high resolution imaging. An example of this is shown in Figure \ref{fig:Evaporation_diagramm_field}. The dot visualized on the left of the image is near the center of the whole field, as the image shows only a partial field. \\
+Each field was studied by taking low resolution measurements of the lower left and the upper right side of the field. A few \ce{Pb} dots, representative of the edges and the center of the field were chosen for high resolution imaging. An example of this is shown in Figure \ref{fig:Evaporation_diagramm_field}. The dot visualized on the left of the image is near the center of the whole field, as the image shows only a partial field. \\
 
-The data is filtered by masking the contamination of the \ce{Si} sample. This worked very well since the dots' height is $\approx 3$ nm, while the contamination particles are much taller ($\approx 50$ nm). The area under the mask is interpolated in order to remove most of the particles. \\
+The data is filtered by masking the contamination of the \ce{Si} sample. This approach was effective because the dots' height is approximately $3$ nm, whereas the contamination particles are significantly taller, at around $50$ nm. The area under the mask is interpolated in order to remove most of the particles. \\
 Line cuts close to the line along which the tilt of the dots points were obtained. By fitting a Gaussian falloff to the slopes of the line cut, the penumbra width is measured. The fit function is:
 
 \begin{equation}
@@ -111,7 +111,7 @@ Line cuts close to the line along which the tilt of the dots points were obtaine
 
 where $r$ is the radius of the dot, $b$ is an offset from $0$, $\mu$ is the midpoint of the dot, $h$ is the height of the dot and $\sigma_s$ and $\sigma_l$ are the two different penumbras. This fit function allows the determination of the height, radius and penumbra of each dot.
 
-An example is shown in Figure \ref{fig:evaporation_analysis}. In the example, the elliptical shape of the dot, induced by a tilt, can be easily seen in both image and line cut. This results in $2$ extreme penumbra widths.
+An example is shown in Figure \ref{fig:evaporation_analysis}. In the example, the elliptical shape of the dot, induced by a tilt, can be easily seen in both image and line cut.
  
 \begin{figure}[H]
     \centering
@@ -161,20 +161,26 @@ This process was performed for every recorded dot and with multiple line cuts ne
 	\caption{Data obtained from the previously described method for each of the 5 evaporations, one dot each from the center, the left, the right, the bottom and the top. (\subref{fig:evaporation_measured_penumbra_sigs})smaller penumbra $\sigma_s$.  (\subref{fig:evaporation_measured_penumbra_sigl}) larger penumbra $\sigma_l$. (\subref{fig:evaporation_measured_penumbra_height}) height of the dot. (\subref{fig:evaporation_measured_penumbra_circle_r}) diameter of the circle.}
     \label{fig:evaporation_measured_penumbra}
 \end{figure}
-Figure \ref{fig:evaporation_measured_penumbra} shows the values obtained from analysis of \ce{Pb} dots of each field. 
-For $\sigma_s$ most data is below the $100$ nm threshold. Most of the fields have near $50$ nm penumbra. This shows that very sharp interfaces are possible. It would be expected, that field $1$ and field $5$ should be very similar. Both should show smaller penumbra than the rest since they were performed at lowest distance. This does not appear to be the case. Field $5$ shows some of the smallest penumbras, however they are more like field $3$ rather than $1$. Field $4$ also has the largest penumbras, which is unexpected since it was evaporated at the point of second contact. Both field $2$ and $4$ have the largest uncertainties, due to more noisy data. This noise most likely comes from the AFM tip age. It failed shortly afterward, when someone else was using the AFM. New measurements could not be performed in time. The differences between top, bottom, right, left and center are within measurement uncertainty. Which implies no difference across the field. \\
+Figure \ref{fig:evaporation_measured_penumbra} presents the results obtained from the analysis of \ce{Pb} dots in each field.
+For $\sigma_s$, most of the data falls below the $100$ nm threshold, with the majority of fields exhibiting a penumbra of approximately $50$ nm. This suggests that very sharp evaporation patterns can be achieved. 
+It is expected that fields $1$ and $5$ should show similar results, with smaller penumbras than the other fields, since they were evaporated at the lowest distance. However, this is not the case. Field $5$ exhibits some of the smallest penumbras, but they are more comparable to field $3$ than field $1$. Field $4$, which was evaporated at the point of second contact, unexpectedly shows the largest penumbras. \\
+
+Fields $2$ and $4$ have the largest uncertainties, likely due to noisier data. This noise is attributed to the age of the AFM tip, which failed shortly after these measurements were taken. Unfortunately, new measurements could not be performed in time.\\
+The differences in penumbra width between the top, bottom, right, left, and center of the fields are within the measurement uncertainty, indicating no significant variation across the field. \\
 
 The height of the dots (Figure \ref{fig:evaporation_measured_penumbra_height}) is spread around a mean value of $2.6 \pm 0.3$ nm and shows deviation from the expected $5$ nm expected from flux. \\
 
 The diameter of the \ce{Pb} dots is expected to decrease with subsequent evaporation due to clogging of the mask. This trend is mirrored in the data. The average diameter of evaporation decreases from $3.02 \pm 0.04$ $\mu$m for field $1$ to $2.947 \pm 0.008$ $\mu$m for field $5$. From a linear regression a decrease in diameter of $0.017 \pm 0.004$ $\mu$m per evaporation is determined. \\
 
-The eccentricity of the dot's outer shape was determined by measuring the diameter of multiple line cuts on the circle via fit and comparing measurements of perpendicular line cuts. The resulting eccentricity was as in the weighted mean $0.2 \pm 0.1$, which suggest that the dots are circular within measurement accuracy. This means the outer dot shape is not affected by the tilting effects.\\
+The eccentricity of the dot's outer shape was determined by measuring the diameter of multiple line cuts on the circle via fit and comparing measurements of perpendicular line cuts. The resulting eccentricity was as in the weighted mean $0.2 \pm 0.1$, which suggest that the dots are circular within measurement accuracy. The outer dot shape is not affected by the tilting effects.\\
 
 The larger penumbra data (Figure \ref{fig:evaporation_measured_penumbra_sigl}) indicates no clear pattern within each field, except for possibly a reduction in penumbra for the bottom and center dots. This might be explained by different dots being chosen for each analysis. In the following, the penumbra and direction of tilt will be treated more thoroughly. \\
 
 \section{Tilt and deformation}
 
-All evaporated dots, showed elongation of the circle, even when the mask was in full contact with the sample. If this was due to misalignment between the entire mask and the sample, one would expect the direction of the tilt to be uniform. The size of $\sigma_l$ would also diminish along the direction of the tilt. To determine if this was the case the direction of the angle of the major axis was measured (example Fig. \ref{fig:evaporation_tilts_example}) and recorded for all fields (Fig. \ref{fig:evaporation_tilts_all}). As shown in Figure \ref{fig:evaporation_tilts_all} the direction of the tilt points outwards for dots on the edge. This suggests the mask itself is bent towards the edges. \\
+All evaporated dots exhibited elongation of the circle, even when the mask was in full contact with the sample. If this elongation were due to misalignment between the entire mask and the sample, one would expect the direction of the tilt to be uniform across the sample. Additionally, the size of $sigma_l$ would be expected to decrease along the direction of the tilt.\\
+
+To investigate this, the direction of the angle of the major axis was measured (as shown in the example in Figure \ref{fig:evaporation_tilts_example}) and recorded for all fields (Figure \ref{fig:evaporation_tilts_all}). The results, presented in Figure \ref{fig:evaporation_tilts_all}, reveal that the direction of the tilt points outward for dots located on the edge of the sample. This suggests that the mask itself is bent towards the edges, rather than being misaligned with the sample. \\
 
 \begin{figure}[H]
     \centering
@@ -215,7 +221,7 @@ The smallest minor axis found in the AFM data was $2.15 \pm 0.08$ $\mu$m compare
 
 To check whether the Mask was undamaged during the evaporation, the mask was examined via SEM. The resulting images can be seen in Figure \ref{fig:evaporation_SEM}. 
 
-The image of the mask (Figure \ref{fig:evaporation_SEM_mask}) shows no damage to the mask. The white areas are charging artifacts and were not stable in multiple images. The mask appears to be bending. This is not a real deformation, but the result of charging artifacts and an inherent fish-eye effect of SEM images at high magnification. 
+The image of the mask (Figure \ref{fig:evaporation_SEM_mask}) reveals no visible damage to the mask. The white areas in the image are charging artifacts, which were not stable across multiple images. The mask appears to be bending, but this is not a real deformation. Instead, it is an artifact caused by charging effects and the inherent fish-eye distortion that occurs in SEM images at high magnification.
 
 \begin{figure}[H]
     \centering
@@ -238,7 +244,7 @@ The image of the mask (Figure \ref{fig:evaporation_SEM_mask}) shows no damage to
 \end{figure}
 
 An example of this clogging in the SEM image is shown in Figure \ref{fig:evaporation_SEM_analysis_clog}
-To further check if the clogging artifacts correspond to the directions of tilt shown in Figure \ref{fig:evaporation_tilts} the directions are overlayed in Figure \ref{fig:evaporation_SEM_analysis_clog_overlay}. The directions correspond to the direction shown in the SEM image, except for some outliers. It also points outwards. For a lot of points the clogging is not clearly visible in the image however, so that no strong conclusion can be drawn from the SEM image alone. \\
+To further check if the clogging artifacts correspond to the directions of tilt shown in Figure \ref{fig:evaporation_tilts} the directions are overlayed in Figure \ref{fig:evaporation_SEM_analysis_clog_overlay}. The directions correspond to the direction shown in the SEM image, except for some outliers. It also points outwards. However, for many points, the clogging is not clearly visible in the image, making it difficult to draw a strong conclusion from the SEM image alone.\\
 
 The evaporation of field $2$ shown in Figure \ref{fig:evaporation_SEM_sample} shows the elliptical tilt also visible in the AFM images. The elliptical part of the dot shows different value in the SEM image, which is an indicator, that the conductivity is different for that part of the dot. \\
 
@@ -248,12 +254,33 @@ Similar effects were previously observed, when turbo pumps were in operation dur
 
 \section{Simulation} \label{sec:simulation}
 \subsection{Overview and principle}
-In order to gain more information about the different hypotheses for the tilted evaporation dots, a simple evaporation simulation program was written. The simulation is based on ray tracing and is written in the open source Godot game engine, since game engines support checking of rays against collision natively and thus a ray tracing simulation could be implemented quickly. \\
+To gain a deeper understanding of the various hypotheses surrounding the tilted evaporation dots, a simple evaporation simulation program was developed. The simulation is based on ray tracing and was written using the open-source Godot game engine. The choice of Godot was motivated by its native support for ray collision detection, which enabled the rapid implementation of a ray tracing simulation. \\
 
-Objects in the Godot game engine are moved, rotated and scaled with a $3 \times 4$ matrix called a "transform" matrix. This matrix performs rotations via their quaternion representation, which is a way to represent $3$-dimensional rotations as a $4$ component complex number. Modifying the transform matrix directly is possible, but would be very unintuitive and cumbersome, so the engine allows modification of the component's displacement and scale via $3$D vectors. The components of the displacement vector will be called x, y and z. The rotation can be modified via Euler angles. Internally the Euler angles are called x, y and z as well, based on the axis they rotate around. To avoid confusion the angles will be called $\alpha$, $\beta$ and $\gamma$, where $\alpha$ rotates around the x-axis, $\beta$ around the y-axis and $\gamma$ around the z-axis.
+Objects in the Godot game engine are moved, rotated and scaled with a $3 \times 4$ matrix called a "transform" matrix. This matrix performs rotations via their quaternion representation, which is a way to represent $3$-dimensional rotations as a $4$ component complex number. Modifying the transform matrix directly is possible, but would be very unintuitive and cumbersome, so the engine allows modification of the component's displacement and scale via $3$D vectors. The components of the displacement vector will be called x, y and z. The rotation can be modified via Euler angles. Internally the Euler angles are called x, y and z as well, based on the axis they rotate around. To avoid confusion the angles will be referred to as $\alpha$, $\beta$ and $\gamma$, where $\alpha$ rotates around the x-axis, $\beta$ around the y-axis and $\gamma$ around the z-axis. \\
 
-The simulation works as follows:
-At a time $0$ and at a distance $L$ from the sample a random point inside a circle is generated. This represents the aperture of the crucible. From it a ray is cast to a point behind the sample. The point behind the mask is chosen such that the ray casts in a cone with opening angle $\phi$. The ray is then checked for collision with a mask hole, which is represented by a cylinder with very small height. If collision with the mask hole is determined, the position at which the sample is hit is determined. Otherwise the ray is discarded. This position is then recorded in an array. It is structured like an image, spanning a user defined area around the middle of the sample with user specified resolution in pixels. For each element in the array, the amount of hits it has received is stored. This step is repeated many times in a single time step. \\
+%The simulation works as follows:
+%At a time $0$ and at a distance $L$ from the sample a random point inside a circle is generated. This represents the aperture of the crucible. From it a ray is cast to a point behind the sample. The point behind the mask is chosen such that the ray casts in a cone with opening angle $\phi$. The ray is then checked for collision with a mask hole, which is represented by a cylinder with very small height. If collision with the mask hole is determined, the position at which the sample is hit is determined. Otherwise the ray is discarded. This position is then recorded in an array. It is structured like an image, spanning a user defined area around the middle of the sample with user specified resolution in pixels. For each element in the array, the amount of hits it has received is stored. This step is repeated many times in a single time step. \\
+
+The model used in this simulation makes several assumptions:
+
+\begin{itemize}
+	\item Molecules travel in straight paths.
+	\item Deposition occurs immediately upon impact with the sample with a sticking factor of $1$.
+	\item No diffusion of particles occurs after deposition.
+	\item Particles are assumed to be smaller than one pixel in the final image, effectively treating them as point-like objects.
+\end{itemize} 
+
+The simulation operates as follows:
+\begin{enumerate}
+\item At time $0$ and at a distance $L$ from the sample, a random point is generated within a circle, representing the aperture of the crucible.
+\item From this point, a ray is cast towards a point behind the sample, such that the ray forms a cone with an opening angle $\phi$.
+\item The ray is then checked for collision with a mask hole, which is modeled as a cylinder with a very small height.
+\item If a collision with the mask hole is detected, the position where the sample is hit is determined. Otherwise, the ray is discarded.
+\item The hit position is recorded in an array, which is structured like an image, covering a user-defined area around the center of the sample with a specified resolution in pixels.
+\item For each element in the array, the number of hits it has received is stored.
+\item This process is repeated multiple times within a single time step.
+\end{enumerate}
+This simulation allows for the modeling of the evaporation process and the resulting deposition pattern on the sample. \\
 
 %\begin{figure}[H]
 %    \centering
@@ -262,7 +289,7 @@ At a time $0$ and at a distance $L$ from the sample a random point inside a circ
 %    \label{fig:evaporation_simulation_godotcoords}
 %\end{figure
 
-In order to simulate vibration effects, the cylinder collider for the mask can be moved and rotated in a periodic manner. The rotation, position and oscillation period are parameters given by the user. After each time step the collider is moved. The position of the current time step is obtained by linear interpolation between the start position and rotation and the end position and rotation. The interpolation parameter is determined with the function $|\sin(\frac{t}{T})|$, where $T$ is the period of the oscillation in time steps and $t$ is the current time step. This allows the simulation of $3$D vibrations. It does not take into account possible bending of the mask, since the colliders are stiff rigid bodies, but using rotation, bending can be locally approximated. \\
+In order to simulate vibration effects, the cylinder collider of the mask can be moved and rotated in a periodic manner. The rotation, position and oscillation period are parameters given by the user. After each time step, the collider is moved to a new position, which is determined by interpolating between the start and end positions and rotations. The interpolation parameter is determined with the function $|\sin(\frac{t}{T})|$, where $T$ is the period of the oscillation in time steps and $t$ is the current time step. This allows for the simulation of $3$D vibrations. It does not take into account possible bending of the mask, since the colliders are stiff rigid bodies, but using rotation, bending can be locally approximated. \\
 
 After a user specified time has passed, the amount of hits on each pixel is saved into a file and the image can then be displayed using a python script. For a more detailed look at the different parameters the simulation provides see the Appendix \ref{sec:appendix_raycast}.\\
 
@@ -286,7 +313,9 @@ After a user specified time has passed, the amount of hits on each pixel is save
 
 An image of a simple simulation for an oscillating mask dot with parameters obtained from the AFM measurement can be seen in Figure \ref{fig:evaporation_simulation_first_compare_SIM}. The parameters for the amplitude of the oscillation were extracted from the AFM image shown in Figure \ref{fig:evaporation_simulation_first_compare_AFM}. Vibrations were assumed to be harmonic during the deposition and different sticking factors of \ce{Pb}-\ce{Si} and \ce{Pb}-\ce{Pb} were not considered. The oscillation was modeled with a displacement of $0.143$ $\mu$m in x and $-0.358$ $\mu$m in z direction and a tilt of $-41.12^\circ$ in $\alpha$, $10^\circ$ in $\beta$ and $31^\circ$ in $\gamma$. \\
 
-A local deformation of nearly $45^\circ$ at a single hole site would lead to large strain on the mask. The visible tilt is most likely an outcome of both an x-y displacement and a bending of the mask. If it would have been caused by vibrations only, the mask would oscillate between 2 positions. The $2$ extreme positions would have overlap, which is elliptical. If there is now an additional displacement component in the z direction, a smaller circle on top of the flat mask position would form. It is likely that the effect on the edge is an overlap of both a bending of the mask giving the mask some angle and an additional contribution from the displacement in both x-y and z direction. A simulation of this is shown in Figure \ref{fig:evaporation_simulation_overlap}.
+A local deformation of approximately $45^\circ$ at a single hole site would result in significant strain on the mask. The observed tilt is likely the outcome of a combination of x-y displacement and bending of the mask. If the tilt were solely caused by vibrations, the mask would oscillate between two positions, resulting in an elliptical overlap of the two extreme positions.
+
+However, if there is an additional displacement component in the z-direction, a smaller circle would form on top of the flat mask position. It is probable that the effect observed at the edge is an overlap of both the bending of the mask, which gives it an angle, and an additional contribution from displacement in both the x-y and z directions. A simulation of this phenomenon is shown in Figure \ref{fig:evaporation_simulation_overlap}.
 
 \begin{figure}[H]
     \centering
@@ -295,7 +324,7 @@ A local deformation of nearly $45^\circ$ at a single hole site would lead to lar
     \label{fig:evaporation_simulation_overlap}
 \end{figure}
 
-The amplitude of displacement in the example in Figure \ref{fig:evaporation_simulation_first_compare_SIM} is $\approx 0.4$ $\mu$m, this is in line with the peak to peak amplitude of an active turbomolecular pump given by $1$ $\mu$m, obtained in the PhD thesis of Priyamvada Bhaskar~\cite{Bhaskar}. While the lateral dot shift seen in Fig \ref{fig:evaporation_simulation_first_compare} is refleceted in this specific simulation, it does not represent the exact shape of the deformation of the dot.. For example the elliptical penumbra (\textcolor{tab_red}{red} in Figure \ref{fig:evaporation_simulation_first_compare_AFM}) is very rough in the AFM image, but on average of equal height, while in the simulation the penumbra gradually decreases. Furthermore, the lower edge of the elliptical shape visible in the AFM dot below the circle (\textcolor{tab_cyan}{cyan} in Figure \ref{fig:evaporation_simulation_first_compare_AFM}) is so faint as to be invisible in the AFM image, while it is very pronounced in the simulated image. The lower edge is sharp in the AFM image $61 \pm 9$ nm while it is smeared out in the simulated image. Parameters were obtained as described in Figure \ref{fig:penumbra_tilt_sigmas}.\\
+The amplitude of displacement in the example in Figure \ref{fig:evaporation_simulation_first_compare_SIM} is $\approx 0.4$ $\mu$m, this is in line with the peak to peak amplitude of an active turbomolecular pump given by $1$ $\mu$m, obtained in the PhD thesis of Priyamvada Bhaskar~\cite{Bhaskar}. While the lateral dot shift seen in Fig \ref{fig:evaporation_simulation_first_compare} is refleceted in this specific simulation, it does not represent the exact shape of the deformation of the dot. For instance, the elliptical penumbra (highlighted in red in Figure \ref{fig:evaporation_simulation_first_compare_AFM}) appears rough in the AFM image, but its height is uniform. In contrast, the simulation shows a penumbra that gradually decreases in height. Furthermore, the lower edge of the elliptical shape visible in the AFM dot below the circle (\textcolor{tab_cyan}{cyan} in Figure \ref{fig:evaporation_simulation_first_compare_AFM}) is invisible in the AFM image, while it is very pronounced in the simulated image. The lower edge is sharp in the AFM image $61 \pm 9$ nm while it is smeared out in the simulated image. Parameters were obtained as described in Figure \ref{fig:penumbra_tilt_sigmas}.\\
 
 The different roughness of circle and ellipse might suggest different possible reasons. First it could be a chronological effect where the circle is deposited first, and the ellipse is deposited second. Another possibility is that the vibration causes the displacement and bending of the mask in a pattern that is anharmonic, which causes the extreme points of the oscillation to be preferred. In order to investigate possible sources of this effect, the simulation was amended. \\
 
@@ -320,10 +349,14 @@ The different roughness of circle and ellipse might suggest different possible r
     \label{fig:evaporation_simulation_sharpness}
 \end{figure}
 
-The effect of this can be seen in Figure \ref{fig:evaporation_simulation_sharpness_stick_initial}. Compared with the simpler model (Figure \ref{fig:evaporation_simulation_sharpness_stick_simple}) this is more similar to the AFM measurement. Another possibility is an oscillation, which is not harmonic. For this instead of choosing the oscillation as $\sin(\frac{t}{T} + \phi)$ with $t$ being current time, $T$ the oscillation period and $\phi$ being a phase shift. Instead the oscillation is parametrized as $\sin(\frac{t}{T} + \phi)^p$ with $p$ being the oscillation power. The resulting image can be seen in Figure \ref{fig:evaporation_simulation_sharpness_stick_power}. The effect of this is very similar to the initial circular shape. The vibrations causing the deformation and tilt are unlikely to be very anharmonic, but due to growth of thin films happening near grains, the actual growth of \ce{Pb} on the \ce{Si} is concentrated at the extreme positions of the oscillation.
+Another possible reason is a chronology of events where the growth happens first on the outer circle and then on the elliptical shape, as previously discussed. This was modeled as an initial phase of user defined time $t_0$ where the mask was not oscillated. \\
+The effect of this can be observed in Figure \ref{fig:evaporation_simulation_sharpness_stick_initial}.
+Compared to the simpler model (Figure \ref{fig:evaporation_simulation_sharpness_stick_simple}), this result is more similar to the AFM measurement. \\
+
+Another possibility is that the oscillation is not harmonic. Instead of using the standard oscillation function $\sin(\frac{t}{T} + \phi)$, where $t$ is the current time, $T$ is the oscillation period, and $\phi$ is the phase shift, the oscillation is parametrized as $\sin(\frac{t}{T} + \phi)^p$, where $p$ is the oscillation power. The resulting image is shown in Figure \ref{fig:evaporation_simulation_sharpness_stick_power}. \\
 
 In the AFM image the surface of the outer is rougher than the surface of the inner circle. On average, the roughness is $1.7 \pm 0.4$ times higher. This could be due to particles first forming larger grains, which is common for PVD~\cite{grain_growth}. With larger layer height this effect typically becomes less visible. \\
-Another possible reason is a chronology of events where the growth happens first on the outer circle and then on the elliptical shape, as previously discussed. \\
+It is unlikely that the vibrations causing the deformation and tilt are highly anharmonic. However, due to the growth of thin films occurring near grain boundaries, the actual growth of Pb on Si is concentrated at the extreme positions of the oscillation. \\
 
 The grain growth can be be modeled in the simulation by penalizing deposition for pixels, where no material has been deposited previously. The probability to deposit on an empty surface is a user controlled parameter called "first\_layer\_depo\_prob". It specifies the probability with which a particle hitting the sample is deposited, when no material has previously been deposited on the relevant pixel. \\
 
@@ -350,9 +383,9 @@ The grain growth can be be modeled in the simulation by penalizing deposition fo
 
 The results of adding this penalty for initial deposition are shown in Figure \ref{fig:evaporation_simulation_rejection_after}. Compared to the previous simulation step in Figure \ref{fig:evaporation_simulation_rejection_prev} the roughness of the dot increased while the height has decreased. The outer tail of the ellipse disappears nearly completely. This version matches the deposition in the actual AFM image more closely, but crucially the decreased roughness of the elliptical part of the dot is not mirrored in the simulation. \\
 
-Particles impinging on the surface will typically diffuse to a nearby large nucleation site. The simulation does not take this effect into account at all. This could be implemented by having pixels interact with neighboring ones.\\
+Particles impinging on the surface will typically diffuse to a nearby large nucleation site. The simulation does not take this effect into account. This can be implemented by having pixels interact with neighboring ones.\\
 
-Apart from this the simulation image matches the one given by the AFM measurement pretty well. This shows that vibrations bending the hole pattern of the mask in combination with a displacement are a plausible explanation for the abberant penumbra of the measured dots. \\
+Apart from this the simulation image matches the one given by the AFM measurement. This shows that vibrations bending the hole pattern of the mask in combination with a displacement are a plausible explanation for the abberant penumbra of the measured dots. \\
 %
 %\begin{figure}[H]
 %    \centering
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diff --git a/thesis.pdf b/thesis.pdf
index 1660aa649f2a481699814868fa11b954ffda7d95..da9938e74c3ee42b6e3344d98ab93d38c91b2fe2 100644
Binary files a/thesis.pdf and b/thesis.pdf differ
diff --git a/thesis.synctex.gz b/thesis.synctex.gz
index 768be0a5cd449e441198a983db35f8c1cea9538e..9fd2f1b3e0388b481ffbf303d793b933f28fc352 100644
Binary files a/thesis.synctex.gz and b/thesis.synctex.gz differ
diff --git a/thesis.toc b/thesis.toc
index 9c6ac4c98a2f0b6f730369383e3dcc8abd2255b9..e7994d6491c2a95a831de7d3d6acd60a421169fb 100644
--- a/thesis.toc
+++ b/thesis.toc
@@ -10,103 +10,105 @@
 \contentsline {section}{\numberline {1.5}Shadow mask alignment}{15}{section.1.5}%
 \contentsline {subsection}{\numberline {1.5.1}Motor screw configuration}{15}{subsection.1.5.1}%
 \contentsline {subsection}{\numberline {1.5.2}Motor calibration}{16}{subsection.1.5.2}%
-\contentsline {subsection}{\numberline {1.5.3}Optical alignment}{20}{subsection.1.5.3}%
-\contentsline {subsection}{\numberline {1.5.4}Capacitive distance measurements}{22}{subsection.1.5.4}%
-\contentsline {section}{\numberline {1.6}Mask Aligner operation}{25}{section.1.6}%
-\contentsline {subsection}{\numberline {1.6.1}Sample preparation}{25}{subsection.1.6.1}%
-\contentsline {section}{\numberline {1.7}Measurement techniques}{26}{section.1.7}%
-\contentsline {subsection}{\numberline {1.7.1}Atomic Force Microscopy}{26}{subsection.1.7.1}%
-\contentsline {subsubsection}{Modes}{27}{section*.24}%
-\contentsline {paragraph}{Contact}{27}{section*.26}%
-\contentsline {paragraph}{Non-Contact}{27}{section*.27}%
-\contentsline {paragraph}{Tapping}{28}{section*.28}%
-\contentsline {subsection}{\numberline {1.7.2}Scanning Electron Microscopy}{28}{subsection.1.7.2}%
-\contentsline {chapter}{\numberline {2}Mask Aligner repairs and optimizations}{31}{chapter.2}%
-\contentsline {section}{\numberline {2.1}Overview}{31}{section.2.1}%
-\contentsline {section}{\numberline {2.2}General UHV device preparation}{32}{section.2.2}%
-\contentsline {subsection}{\numberline {2.2.1}UHV compatible Soldering}{32}{subsection.2.2.1}%
-\contentsline {section}{\numberline {2.3}Soldering anchors}{32}{section.2.3}%
-\contentsline {section}{\numberline {2.4}Piezo regluing}{35}{section.2.4}%
-\contentsline {section}{\numberline {2.5}Z3 motor}{36}{section.2.5}%
-\contentsline {subsection}{\numberline {2.5.1}Front plate repair}{37}{subsection.2.5.1}%
-\contentsline {subsection}{\numberline {2.5.2}Small capacitance stack}{39}{subsection.2.5.2}%
-\contentsline {section}{\numberline {2.6}Feed through cabling optimizations}{40}{section.2.6}%
-\contentsline {section}{\numberline {2.7}Final test}{41}{section.2.7}%
-\contentsline {chapter}{\numberline {3}Evaporations and measurement}{43}{chapter.3}%
-\contentsline {section}{\numberline {3.1}Evaporation configuration}{43}{section.3.1}%
-\contentsline {section}{\numberline {3.2}Contamination}{45}{section.3.2}%
-\contentsline {section}{\numberline {3.3}Penumbra}{46}{section.3.3}%
-\contentsline {section}{\numberline {3.4}Tilt and deformation}{50}{section.3.4}%
-\contentsline {section}{\numberline {3.5}Simulation}{53}{section.3.5}%
-\contentsline {subsection}{\numberline {3.5.1}Overview and principle}{53}{subsection.3.5.1}%
-\contentsline {subsection}{\numberline {3.5.2}Results}{55}{subsection.3.5.2}%
-\contentsline {subsection}{\numberline {3.5.3}Software improvements}{58}{subsection.3.5.3}%
-\contentsline {subsection}{\numberline {3.5.4}Final Remark}{59}{subsection.3.5.4}%
-\contentsline {chapter}{\numberline {4}Electronics}{60}{chapter.4}%
-\contentsline {section}{\numberline {4.1}RHK piezo motor controller}{60}{section.4.1}%
-\contentsline {subsection}{\numberline {4.1.1}Overview}{60}{subsection.4.1.1}%
-\contentsline {paragraph}{amplitude}{60}{section*.56}%
-\contentsline {paragraph}{sweep period}{60}{section*.57}%
-\contentsline {paragraph}{time between sweeps}{60}{section*.58}%
-\contentsline {subsection}{\numberline {4.1.2}Pulse shape}{60}{subsection.4.1.2}%
-\contentsline {section}{\numberline {4.2}KIM001}{61}{section.4.2}%
-\contentsline {subsection}{\numberline {4.2.1}Overview}{61}{subsection.4.2.1}%
-\contentsline {subsection}{\numberline {4.2.2}Pulse shape}{61}{subsection.4.2.2}%
-\contentsline {subsection}{\numberline {4.2.3}Voltage behavior}{62}{subsection.4.2.3}%
-\contentsline {section}{\numberline {4.3}Mask Aligner controller "Walker"}{63}{section.4.3}%
-\contentsline {subsection}{\numberline {4.3.1}Overview}{63}{subsection.4.3.1}%
-\contentsline {subsection}{\numberline {4.3.2}Signal generation}{63}{subsection.4.3.2}%
-\contentsline {subsection}{\numberline {4.3.3}Fast flank}{64}{subsection.4.3.3}%
-\contentsline {subsection}{\numberline {4.3.4}Amplification}{65}{subsection.4.3.4}%
-\contentsline {subsection}{\numberline {4.3.5}Programming}{66}{subsection.4.3.5}%
-\contentsline {subsubsection}{Parameters}{66}{section*.65}%
-\contentsline {paragraph}{Amplitude (amp)}{66}{section*.66}%
-\contentsline {paragraph}{Voltage (volt)}{66}{section*.67}%
-\contentsline {paragraph}{Channel}{66}{section*.68}%
-\contentsline {paragraph}{Max Step}{66}{section*.69}%
-\contentsline {paragraph}{Polarity}{66}{section*.70}%
-\contentsline {subsection}{\numberline {4.3.6}Measured pulse shape}{66}{subsection.4.3.6}%
-\contentsline {subsection}{\numberline {4.3.7}Operation with the Mask Aligner}{68}{subsection.4.3.7}%
-\contentsline {chapter}{Conclusions and Outlook}{70}{chapter*.74}%
-\contentsline {chapter}{Bibliography}{71}{chapter*.75}%
-\contentsline {chapter}{List of Abbreviations}{74}{chapter*.76}%
-\contentsline {chapter}{Appendix}{75}{chapter*.77}%
-\contentsline {section}{\numberline {A}LockIn amplifier settings}{75}{section.4.1}%
-\contentsline {section}{\numberline {B}Evaporation parameters}{75}{section.4.2}%
-\contentsline {section}{\numberline {C}Walker principle diagram}{76}{section.4.3}%
-\contentsline {section}{\numberline {D}Walker circuit diagrams}{76}{section.4.4}%
-\contentsline {section}{\numberline {E}Mask Aligner Walker Commands}{80}{section.4.5}%
-\contentsline {paragraph}{pulse?}{80}{section*.81}%
-\contentsline {paragraph}{pol x}{80}{section*.82}%
-\contentsline {paragraph}{amp x}{80}{section*.83}%
-\contentsline {paragraph}{volt x}{80}{section*.84}%
-\contentsline {paragraph}{channel x}{80}{section*.85}%
-\contentsline {paragraph}{maxmstep x}{80}{section*.86}%
-\contentsline {paragraph}{step x}{80}{section*.87}%
-\contentsline {paragraph}{mstep x}{80}{section*.88}%
-\contentsline {paragraph}{cancel}{81}{section*.89}%
-\contentsline {paragraph}{help}{81}{section*.90}%
-\contentsline {section}{\numberline {F}Mask Aligner Walker Code}{81}{section.4.6}%
-\contentsline {section}{\numberline {G}Raycast Simulation}{92}{section.4.7}%
-\contentsline {paragraph}{radius\_1}{92}{section*.91}%
-\contentsline {paragraph}{angle}{92}{section*.92}%
-\contentsline {paragraph}{radius\_mask}{93}{section*.93}%
-\contentsline {paragraph}{distance\_circle\_mask}{93}{section*.94}%
-\contentsline {paragraph}{distance\_sample}{93}{section*.95}%
-\contentsline {paragraph}{rays\_per\_frame}{93}{section*.96}%
-\contentsline {paragraph}{running\_time}{93}{section*.97}%
-\contentsline {paragraph}{deposition\_gain}{93}{section*.98}%
-\contentsline {paragraph}{penalize\_deposition}{93}{section*.99}%
-\contentsline {paragraph}{first\_layer\_deposition\_prob}{93}{section*.100}%
-\contentsline {paragraph}{oscillation\_period}{93}{section*.101}%
-\contentsline {paragraph}{delay\_oscill\_time}{93}{section*.102}%
-\contentsline {paragraph}{save\_in\_progress\_images}{93}{section*.103}%
-\contentsline {paragraph}{save\_intervall}{93}{section*.104}%
-\contentsline {paragraph}{oscillation\_dir}{93}{section*.105}%
-\contentsline {paragraph}{oscillation\_rot\_s}{93}{section*.106}%
-\contentsline {paragraph}{oscillation\_rot\_e}{94}{section*.107}%
-\contentsline {paragraph}{random\_seed}{94}{section*.108}%
-\contentsline {paragraph}{x\_min, x\_max, y\_min, y\_max}{94}{section*.109}%
-\contentsline {paragraph}{resolution}{94}{section*.110}%
-\contentsline {paragraph}{path}{94}{section*.111}%
-\contentsline {chapter}{Acknowledgments}{95}{chapter*.112}%
+\contentsline {subsection}{\numberline {1.5.3}Optical alignment}{21}{subsection.1.5.3}%
+\contentsline {subsection}{\numberline {1.5.4}Capacitive distance measurements}{23}{subsection.1.5.4}%
+\contentsline {subsection}{\numberline {1.5.5}Reproducibility}{26}{subsection.1.5.5}%
+\contentsline {subsubsection}{Reproducibility when removing sample/mask}{26}{section*.23}%
+\contentsline {section}{\numberline {1.6}Mask Aligner operation}{27}{section.1.6}%
+\contentsline {subsection}{\numberline {1.6.1}Sample preparation}{27}{subsection.1.6.1}%
+\contentsline {section}{\numberline {1.7}Measurement techniques}{28}{section.1.7}%
+\contentsline {subsection}{\numberline {1.7.1}Atomic Force Microscopy}{28}{subsection.1.7.1}%
+\contentsline {subsubsection}{Modes}{29}{section*.26}%
+\contentsline {paragraph}{Contact}{30}{section*.28}%
+\contentsline {paragraph}{Non-Contact}{30}{section*.29}%
+\contentsline {paragraph}{Tapping}{31}{section*.30}%
+\contentsline {subsection}{\numberline {1.7.2}Scanning Electron Microscopy}{31}{subsection.1.7.2}%
+\contentsline {chapter}{\numberline {2}Mask Aligner repairs and optimizations}{34}{chapter.2}%
+\contentsline {section}{\numberline {2.1}Overview}{34}{section.2.1}%
+\contentsline {section}{\numberline {2.2}General UHV device preparation}{35}{section.2.2}%
+\contentsline {subsection}{\numberline {2.2.1}UHV compatible Soldering}{35}{subsection.2.2.1}%
+\contentsline {section}{\numberline {2.3}Soldering anchors}{35}{section.2.3}%
+\contentsline {section}{\numberline {2.4}Piezo regluing}{38}{section.2.4}%
+\contentsline {section}{\numberline {2.5}Z3 motor}{39}{section.2.5}%
+\contentsline {subsection}{\numberline {2.5.1}Front plate repair}{40}{subsection.2.5.1}%
+\contentsline {subsection}{\numberline {2.5.2}Small capacitance stack}{42}{subsection.2.5.2}%
+\contentsline {section}{\numberline {2.6}Feed through cabling optimizations}{43}{section.2.6}%
+\contentsline {section}{\numberline {2.7}Final test}{44}{section.2.7}%
+\contentsline {chapter}{\numberline {3}Evaporations and measurement}{46}{chapter.3}%
+\contentsline {section}{\numberline {3.1}Evaporation configuration}{46}{section.3.1}%
+\contentsline {section}{\numberline {3.2}Contamination}{48}{section.3.2}%
+\contentsline {section}{\numberline {3.3}Penumbra}{49}{section.3.3}%
+\contentsline {section}{\numberline {3.4}Tilt and deformation}{53}{section.3.4}%
+\contentsline {section}{\numberline {3.5}Simulation}{56}{section.3.5}%
+\contentsline {subsection}{\numberline {3.5.1}Overview and principle}{56}{subsection.3.5.1}%
+\contentsline {subsection}{\numberline {3.5.2}Results}{58}{subsection.3.5.2}%
+\contentsline {subsection}{\numberline {3.5.3}Software improvements}{61}{subsection.3.5.3}%
+\contentsline {subsection}{\numberline {3.5.4}Final Remark}{62}{subsection.3.5.4}%
+\contentsline {chapter}{\numberline {4}Electronics}{63}{chapter.4}%
+\contentsline {section}{\numberline {4.1}RHK piezo motor controller}{63}{section.4.1}%
+\contentsline {subsection}{\numberline {4.1.1}Overview}{63}{subsection.4.1.1}%
+\contentsline {paragraph}{amplitude}{63}{section*.58}%
+\contentsline {paragraph}{sweep period}{63}{section*.59}%
+\contentsline {paragraph}{time between sweeps}{63}{section*.60}%
+\contentsline {subsection}{\numberline {4.1.2}Pulse shape}{63}{subsection.4.1.2}%
+\contentsline {section}{\numberline {4.2}KIM001}{64}{section.4.2}%
+\contentsline {subsection}{\numberline {4.2.1}Overview}{64}{subsection.4.2.1}%
+\contentsline {subsection}{\numberline {4.2.2}Pulse shape}{64}{subsection.4.2.2}%
+\contentsline {subsection}{\numberline {4.2.3}Voltage behavior}{65}{subsection.4.2.3}%
+\contentsline {section}{\numberline {4.3}Mask Aligner controller "Walker"}{66}{section.4.3}%
+\contentsline {subsection}{\numberline {4.3.1}Overview}{66}{subsection.4.3.1}%
+\contentsline {subsection}{\numberline {4.3.2}Signal generation}{66}{subsection.4.3.2}%
+\contentsline {subsection}{\numberline {4.3.3}Fast flank}{67}{subsection.4.3.3}%
+\contentsline {subsection}{\numberline {4.3.4}Amplification}{68}{subsection.4.3.4}%
+\contentsline {subsection}{\numberline {4.3.5}Programming}{69}{subsection.4.3.5}%
+\contentsline {subsubsection}{Parameters}{69}{section*.67}%
+\contentsline {paragraph}{Amplitude (amp)}{69}{section*.68}%
+\contentsline {paragraph}{Voltage (volt)}{69}{section*.69}%
+\contentsline {paragraph}{Channel}{69}{section*.70}%
+\contentsline {paragraph}{Max Step}{69}{section*.71}%
+\contentsline {paragraph}{Polarity}{69}{section*.72}%
+\contentsline {subsection}{\numberline {4.3.6}Measured pulse shape}{69}{subsection.4.3.6}%
+\contentsline {subsection}{\numberline {4.3.7}Operation with the Mask Aligner}{71}{subsection.4.3.7}%
+\contentsline {chapter}{Conclusions and Outlook}{73}{chapter*.76}%
+\contentsline {chapter}{Bibliography}{74}{chapter*.77}%
+\contentsline {chapter}{List of Abbreviations}{77}{chapter*.78}%
+\contentsline {chapter}{Appendix}{78}{chapter*.79}%
+\contentsline {section}{\numberline {A}LockIn amplifier settings}{78}{section.4.1}%
+\contentsline {section}{\numberline {B}Evaporation parameters}{78}{section.4.2}%
+\contentsline {section}{\numberline {C}Walker principle diagram}{79}{section.4.3}%
+\contentsline {section}{\numberline {D}Walker circuit diagrams}{79}{section.4.4}%
+\contentsline {section}{\numberline {E}Mask Aligner Walker Commands}{83}{section.4.5}%
+\contentsline {paragraph}{pulse?}{83}{section*.83}%
+\contentsline {paragraph}{pol x}{83}{section*.84}%
+\contentsline {paragraph}{amp x}{83}{section*.85}%
+\contentsline {paragraph}{volt x}{83}{section*.86}%
+\contentsline {paragraph}{channel x}{83}{section*.87}%
+\contentsline {paragraph}{maxmstep x}{83}{section*.88}%
+\contentsline {paragraph}{step x}{83}{section*.89}%
+\contentsline {paragraph}{mstep x}{83}{section*.90}%
+\contentsline {paragraph}{cancel}{84}{section*.91}%
+\contentsline {paragraph}{help}{84}{section*.92}%
+\contentsline {section}{\numberline {F}Mask Aligner Walker Code}{84}{section.4.6}%
+\contentsline {section}{\numberline {G}Raycast Simulation}{95}{section.4.7}%
+\contentsline {paragraph}{radius\_1}{95}{section*.93}%
+\contentsline {paragraph}{angle}{95}{section*.94}%
+\contentsline {paragraph}{radius\_mask}{96}{section*.95}%
+\contentsline {paragraph}{distance\_circle\_mask}{96}{section*.96}%
+\contentsline {paragraph}{distance\_sample}{96}{section*.97}%
+\contentsline {paragraph}{rays\_per\_frame}{96}{section*.98}%
+\contentsline {paragraph}{running\_time}{96}{section*.99}%
+\contentsline {paragraph}{deposition\_gain}{96}{section*.100}%
+\contentsline {paragraph}{penalize\_deposition}{96}{section*.101}%
+\contentsline {paragraph}{first\_layer\_deposition\_prob}{96}{section*.102}%
+\contentsline {paragraph}{oscillation\_period}{96}{section*.103}%
+\contentsline {paragraph}{delay\_oscill\_time}{96}{section*.104}%
+\contentsline {paragraph}{save\_in\_progress\_images}{96}{section*.105}%
+\contentsline {paragraph}{save\_intervall}{96}{section*.106}%
+\contentsline {paragraph}{oscillation\_dir}{96}{section*.107}%
+\contentsline {paragraph}{oscillation\_rot\_s}{96}{section*.108}%
+\contentsline {paragraph}{oscillation\_rot\_e}{97}{section*.109}%
+\contentsline {paragraph}{random\_seed}{97}{section*.110}%
+\contentsline {paragraph}{x\_min, x\_max, y\_min, y\_max}{97}{section*.111}%
+\contentsline {paragraph}{resolution}{97}{section*.112}%
+\contentsline {paragraph}{path}{97}{section*.113}%
+\contentsline {chapter}{Acknowledgments}{98}{chapter*.114}%